ATS-04C-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat Sinks are important components in the electronics industry. Heat sinks are used to draw heat away from a component or circuit in order to keep it from becoming too hot. Many applications today require high performance but still remain energy efficient. For these applications or where heat sinks are used continuously, it is important to select a heat sink with minimal thermal resistance and low temperature increase. The ATS-04C-10-C1-R0 is an extruded heat sink designed as a general purpose cooling solution. It is a finned heat sink made from aluminum with an anodized finish to enhance heat dissipation. The ATS-04C-10-C1-R0 is designed to reduce the operating temperature of electronic components and circuits. This heat sink is highly configurable for different thermal requirements.

ATS-04C-10-C1-R0 Application Field

The ATS-04C-10-C1-R0 is an extruded heat sink applicable for a wide range of industrial and commercial applications. It is suitable for use in industrial, telecommunication, medical, aerospace, automotive, consumer electronics, and other electronic products. Thermal applications typically include fans, sensitive ICs, voltage regulators, transistors, or other electronic components that require efficient heat dissipation.The ATS-04C-10-C1-R0 can be assembled easily and has a high strength-to-weight ratio. It is a cost-effective solution and is capable of dissipating a wide range of power levels in a wide range of operating temperatures. It is also suitable for direct or fan assisted cooling.

ATS-04C-10-C1-R0 Working Principle

Heat sinks work based on the principle of convection. Heat is generated by the power system and transferred to the environment by convection, radiation, and conduction. In this case heat is transferred through the heat sink to the surrounding air. Heat will transfer from the heat sink fins to the air and create a temperature differential with the air. The air then rises, taking away the heat with it and allowing new air to be drawn in, which will then transfer heat away from the heat sink.The ATS-04C-10-C1-R0 has been designed to maximize the convection process. It consists of a top fin which is connected to a series of downwardly-oriented fins, increasing the available surface area and, as a result, the heat dissipation capacity. The number and shape of the fins can be customized according to the specific application’s requirements. The ATS-04C-10-C1-R0 can be used with a fan as well, providing even more effective cooling. Various heat sink materials, such as aluminum or copper, can be used for the ATS-04C-10-C1-R0. The material will affect the heat dissipation efficiency, so selecting the right material is important.

Conclusion

Using an ATS-04C-10-C1-R0 heat sink can have a significant impact on the performance and longevity of an electronic circuit or component. It’s design should be tailored to the specific application and properly configured for optimal operation. Its thermal resistance and low temperature increase will provide effective cooling. As a result, the ATS-04C-10-C1-R0 is a great choice when a high-performance thermal solution is needed.

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