ATS-04C-11-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04C-11-C3-R0-ND

Manufacturer Part#:

ATS-04C-11-C3-R0

Price: $ 3.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04C-11-C3-R0 datasheetATS-04C-11-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.48138
30 +: $ 3.28818
50 +: $ 3.09481
100 +: $ 2.90134
250 +: $ 2.70791
500 +: $ 2.51449
1000 +: $ 2.46614
Stock 1000Can Ship Immediately
$ 3.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are heat dissipating components designed to transfer thermal energy from one medium to another. Heat sink designs range from simple single finned designs to complex shapes that are found in many various applications. The ATS-04C-11-C3-R0 is a low profile high performance heat sink design that is suitable for many different applications.

ATS-04C-11-C3-R0 Application Field and Working Principle

The ATS-04C-11-C3-R0 is designed for air cooling applications. It can be used in a variety of different areas, including in HVAC systems, industrial equipment, and medical equipment. The design of the ATS-04C-11-C3-R0 consists of a large aluminum base, with a number of fins attached to it in an array configuration. The fins are connected to the base by a number of small plastic clips. This allows for a more efficient cooling performance due to the increased surface area and heat dissipation.

The ATS-04C-11-C3-R0 works based on the principles of convection. It uses the natural movement of air to move heat away from the component generating it. The fins provide additional surface area to dissipate the heat, which is pushed away from the component by the airflow. The larger fins also create turbulence in the airflow, which helps to dissipate the heat more efficiently. The number of fins and the shape of the fins also influences the cooling performance of the component.

The ATS-04C-11-C3-R0 is designed for high efficiency cooling and low profile design. It can dissipate large amounts of heat from small components with the help of its efficient fin design. It can also be used in tight spaces due to its low profile design. The ATS-04C-11-C3-R0 can also be used in applications that require low noise levels due to its lack of fans. The ATS-04C-11-C3-R0 is a great choice for those seeking a high performance, efficient thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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