ATS-04C-136-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04C-136-C1-R0-ND

Manufacturer Part#:

ATS-04C-136-C1-R0

Price: $ 6.36
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04C-136-C1-R0 datasheetATS-04C-136-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.72544
30 +: $ 5.40750
50 +: $ 5.08939
100 +: $ 4.77131
250 +: $ 4.45322
500 +: $ 4.13513
1000 +: $ 4.05561
Stock 1000Can Ship Immediately
$ 6.36
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.17°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are efficient and effective devices when it comes to dissipating heat away from components and other components, such as processors, in an electronic device. They are used in many applications where components need to be kept cool. The ATS-04C-136-C1-R0 thermal heat sink is a particular type of heat sink that is used in applications like that of computing, telecommunications, and industrial automation.

The ATS-04C-136-C1-R0 thermal heat sink is designed to be highly efficient in its ability to dissipate heat. This is done through the natural movement of air, also known as convection. It utilizes a unique combination of physical features, such as fins, to efficiently absorb and redirect the heat away from the components. The fins also extend the surface area of the heat sink, allowing for greater heat dissipation. Additionally, the air openings also create an air flow which allows for better heat dissipation.

The ATS-04C-136-C1-R0 thermal heat sink is capable of handling components that have a temperature range that falls between -20°C and 150°C. This large temperature range makes it an ideal solution for a variety of applications, including those in the industrial, computing, telecommunications, and even automotive industries. In addition to its broad temperature range, the ATS-04C-136-C1-R0 is also able to handle extreme conditions such as shock and vibration.

In addition to its ability to handle extreme conditions and temperatures, the ATS-04C-136-C1-R0 also has a variety of other features. It is manufactured with high-efficiency aluminum and is able to resist high temperatures and corrosive environmental conditions. The device also has a range of configurable options, allowing for customization to fit the specific needs of the device in which it is installed. This versatility, combined with its efficient heat dissipation capabilities, makes the ATS-04C-136-C1-R0 an excellent choice for many different types of applications.

The ATS-04C-136-C1-R0 thermal heat sink has been designed to be both simple and reliable. It has a streamlined design that does not require additional mounting hardware, meaning it is easy to install. Additionally, the heat sink is made of high-quality materials, making it durable and long-lasting. This reliability ensures that the device is able to perform its duty over an extended period of time, maximizing its effectiveness as a thermal insulator.

The ATS-04C-136-C1-R0 thermal heat sink is a versatile and reliable heat sink that is designed to dissipate heat away from vital components in a wide range of applications. It is incredibly efficient and possesses a vast temperature range, making it suitable for modern computing, telecommunications, and industrial automation requirements. Additionally, it is easy to install and is made of durable materials, ensuring it can effectively fulfill its purpose for a long time.

The specific data is subject to PDF, and the above content is for reference

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