| Allicdata Part #: | ATS-04C-147-C1-R0-ND |
| Manufacturer Part#: |
ATS-04C-147-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-147-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are a technology that allows heat to be removed from a component of an electronic system in order to protect against overheating or damage. The ATS-04C-147-C1-R0 is an example of a thermal-heat sink that is a one-piece aluminum die-cast design with integrated cooling fins for optimal performance. It is designed to be used in a wide range of applications, from small components to large subsystems, as it can effectively reduce the temperature of a component by at least 10°C.
One of the primary features of the ATS-04C-147-C1-R0 is that it is designed to work by passive conduction. By utilizing the thermal transfer properties of aluminum to draw heat away from a component, it can effectively reduce the temperature of the component without requiring an additional cooling fan to provide airflow. The thermal-heat sink has a high-efficiency heat conduction capacity, allowing it to dissipate heat quickly and keep the component cool at all times.
The ATS-04C-147-C1-R0 has a wide range of applications, including automotive control circuits, LED lighting systems, medical electronics, aerospace, and many other electronic components. It is also compatible with a variety of mounting methods, such as through-hole mounting, wire bonding, and glue bonding. This makes it versatile and easy to install in a wide range of applications. Additionally, the ATS-04C-147-C1-R0 has a low profile design, which makes it suitable for use in tight spaces or devices with limited space.
The ATS-04C-147-C1-R0 can be used in many types of electronic systems to maintain the optimal operation temperature of components. This heat sink has a high thermal conductivity along with a large surface area, allowing it to efficiently dissipate heat away from the component. The large fin area also allows for maximum air circulation while keeping the device surface area small. This helps to reduce system noise and ensures that the device temperature stays within recommended limits.
The ATS-04C-147-C1-R0 is a highly efficient thermal-heat sink that can be utilized in many types of electronic systems. It is designed with a passive conduction system to effectively dissipate heat without the need for additional cooling fans. Its low profile design allows it to fit into tight spaces and to be compatible with a variety of mounting methods. Additionally, it has a large surface area and maximum air circulation, allowing it to maintain optimal operation temperatures and reduce system noise.
The specific data is subject to PDF, and the above content is for reference