| Allicdata Part #: | ATS-04C-147-C3-R0-ND |
| Manufacturer Part#: |
ATS-04C-147-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-147-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an important component that helps transfer the heat away from the processor, and the ATS-04C-147-C3-R0 model is no exception. This thermal heat sink is designed of graphite base and aluminum-clad surface mount fin design. It can effectively dissipate heat away from processors with a maximum power rating of 30W.
The application of this product mainly focuses on providing thermal management solutions in electronic projects. It is used to draw heat away from integrated circuits, connecting them to a heat sink dissipates heat away from the hot spot which helps improve the performance of the components and maintain the temperature at a safe level. The ATS-04C-147-C3-R0 thermal heat sink is suitable for a wide range of applications such as data center backplanes, server cabinets, cooling fans, TV boxes, tablets, set-top boxes, and other electronic devices. This product is also a reliable choice for active cooling applications with its low profile design, maximizing surface area.
The working principle of the ATS-04C-147-C3-R0 thermal heat sink is quite simple. It is designed to absorb and dissipate heat from the components it is attached to. Heat generated by the component is absorbed by the heat sink, and then the heat is dissipated away from the processor via conduction and convection. The heat generated by the processor is then transferred to the fins of the heat sink. As air passes through the fins, the transmitted heat is dissipated away from the sink and the processor, allowing the processor to operate at a safe temperature.
The ATS-04C-147-C3-R0 thermal heat sink is made of aluminum with a galvanized steel thermal interface material (TIM), which is a thermally conductive material that improves the thermal performance of the heat sink. It offers a better dissipating capability and prevents thermal throttling of the heat sink. Apart from that, this product also utilizes a patented flexible reversible clip technology, which allows the user to install the heat sink in both direction for better mounting flexibility.
To conclude, the ATS-04C-147-C3-R0 thermal heat sink provides reliable thermal management solutions for a wide range of applications. Its graphite base and aluminum-clad surface mount fin design makes it an ideal choice in terms of heat dissipation. The patented flexible reversible clip technology and TIM also allows for better mounting flexibility and improved thermal performance.
The specific data is subject to PDF, and the above content is for reference