| Allicdata Part #: | ATS-04C-150-C1-R0-ND |
| Manufacturer Part#: |
ATS-04C-150-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-150-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal management devices used to dissipate heat away from hot components. They are an essential part of any electronic system due to their ability to effectively manage heat while still allowing the components to operate smoothly and efficiently. The ATS-04C-150-C1-R0 is a heat sink with a specially designed internal fin structure, allowing it to dissipate more heat and improve air flow.
This heat sink is made from aluminum and is relatively lightweight, making it easier to install and less bulky than many other models. Its internal fin structure has been designed with a two-step "V" shape, which allows air to flow more evenly over the entire surface. The fins are evenly spaced and have a flat angle that helps to ensure that the air circulates evenly over the heat source. This helps to ensure efficient heat dissipation, which increases the life expectancy of the components it protects.
The ATS-04C-150-C1-R0 heat sink is rated to dissipate up to 150 watts of heat. This is ideal for use in applications that require a medium amount of heat dissipation, such as communication and industrial equipment. It can also be used in applications that require more heat dissipation, such as computer components and video card coolers. Due to its unique fin structure, it is effective at dissipating heat from components with higher wattage ratings.
The ATS-04C-150-C1-R0 heat sink is designed to work best in conjunction with other thermal management components, such as fans, heat pipes, and other thermal control devices. Its specialized fin structure helps to ensure that the air flow generated by these components is distributed evenly across the entire surface of the heat source. This allows the air to flow in such a way that it carries heat away from the component, rather than trapping it. This design ensures that the components are kept cool and operating at peak efficiency.
The ATS-04C-150-C1-R0 heat sink is an effective thermal management solution for a variety of applications. The unique design of its internal fin structure allows it to effectively dissipate heat while also allowing air to circulate more evenly over the heat source. This helps to keep components cool and operating at peak efficiency. Its lightweight design also means that it is easy to install and needs minimal maintenance.
The specific data is subject to PDF, and the above content is for reference