| Allicdata Part #: | ATS-04C-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-04C-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an integral part of thermal management systems, and they are used in a wide range of applications. The ATS-04C-170-C3-R0 thermal-heat sink is specially designed for low profile applications, providing an optimized solution in terms of area and size of cooling components. This heat sink is constructed from aluminum alloy and is equipped with a thermal interface material for excellent thermal performance.
The ATS-04C-170-C3-R0 heat sink features a large thermal mass, allowing it to absorb more heat than other types of heat sinks. This thermal mass enables the heat sink to evenly distribute the heat that is generated by the components it is cooling. This ensures that the heat is evenly dissipated throughout the device, preventing hot spots and ensuring efficient cooling. Additionally, the aluminum alloy construction of the ATS-04C-170-C3-R0 heat sink helps to increase the thermal conductivity of the heat sink, allowing it to transfer heat away from the components more efficiently.
The ATS-04C-170-C3-R0 heat sink uses natural convection to create an airflow around the components that are being cooled. The heat from the components is transferred to the surrounding air, allowing them to cool more quickly and efficiently. The total airflow from the natural convection process is increased by the presence of fans and/or other supplemental cooling systems. The convection process helps to maximize the cooling potential of the heat sink, while also minimizing energy consumption.
The ATS-04C-170-C3-R0 heat sink is ideal for use in a wide range of applications, including automotive, industrial, consumer, and medical electronics. By providing excellent thermal performance, low profile design, and efficient thermal mass, the ATS-04C-170-C3-R0 heat sink is able to provide reliable cooling in even the most demanding environments. The use of a thermal interface material ensures that the performance of the heat sink is maximized, while also providing improved compatibility with a variety of components.
The ATS-04C-170-C3-R0 thermal-heat sink is an effective and reliable cooling solution for a wide range of applications. Its large thermal mass, aluminum alloy construction, and use of a thermal interface material ensure that the heat is dissipated throughout the device, while the natural convection process maximizes the cooling potential of the heat sink. The ATS-04C-170-C3-R0 heat sink is an ideal choice for those looking for a low profile, efficient thermal-heat sink for their application.
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