ATS-04C-185-C3-R0

Thermal - Heat Sinks have become increasingly important in today\'s electronic device market. With the development of technology, heat sinks have gradually replaced the traditional cooling system to disassemble the heat from the system and keep the device in normal operation. One of the best heat sinks is ATS-04C-185-C3-R0, which is commonly used for electronic components, chips and even complete machines. This article focuses on its application field and working principle.

Introduction to ATS-04C-185-C3-R0

ATS-04C-185-C3-R0 is an aluminum alloy heat sink developed by the ChinaLianzhi Industrial Co., Ltd. It is suitable for various electronic components, such as chips, transistors, power components, etc. It has a great capacity for heat dissipation and a thin body structure that allows for easy installation. This type of heat sink has a wide range of uses, from cooling and heat dissipation of consumer electronic components and devices to cooling and heat dissipation of industrial equipments. It also has good electrical properties, corrosion resistance, and good thermal stability.

Application Field

The ATS-04C-185-C3-R0 is applicable to many kinds of electronic equipment, such as integrated circuit (IC) package applications, power semiconductor applications, light emitting diode(LED) applications, and magnetic sensor and drive applications. Because of its excellent heat dissipation performance, it is also used for cooling and heat reduction in applications such as computer servers, Industrial control system, digital photo-setting equipment, mobile phones, notebook computers, power boards, and transformers.

The thermal performance of ATS-04C-185-C3-R0 is maximized if the air flow rate in the vicinity of the heat sink exceeds 30 LFM-40CFM. This means that this type of heat sink is more suitable for applications with sufficient air circulation, and its performance will be reduced when the air flow rate is too low.

Working Principle

The ATS-04C-185-C3-R0 uses aluminum alloy as its main material, which means that it has the excellent characteristics of aluminum, such as good heat conductivity, corrosion resistance and lightweight. In fact, aluminum is one of the best materials for heat sink, as its thermal conductivity is second to none other materials and it also has better heat dissipation ability than other materials.

The ATS-04C-185-C3-R0 works by absorbing the hot air produced by the electronic components and dissipating it into the surrounding air through the aluminum alloy heat exchanger. The exchanger is equipped with several fins, which accelerate the air circulation around the heat sink, consequently improving the overall thermal performance.

In addition, due to its thin design, the ATS-04C-185-C3-R0 takes up less space than other traditional heat sink solutions. This makes it suitable for applications where the installation space is limited. The application of this aluminum alloy heat sink also reduces noise, since aluminum material itself has good sound insulation properties.

Conclusion

ATS-04C-185-C3-R0 is a great choice for cooling and heat dissipation of electronic components, chips, and even complete machines such as computers, industrial controls, and digital photo-setting equipment. Its application field includes IC package applications, power electronic devices, LED applications, and magnetic sensor and drive applications. The main material of this heat sink is aluminum, which has excellent thermal conductivity, corrosion resistance, and sound insulation properties. This aluminum alloy heat sink also has a good air circulation rate, which helps to improve its thermal performance.