| Allicdata Part #: | ATS-04C-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-04C-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal transfer is an important part of any electrical and electronic system. Heat needs to be efficiently dissipated away from components to ensure that the system remains stable and efficient without malfunctioning components. Heat sinks are commonly used for this purpose, and they come in a variety of shapes and sizes, depending on the particular application.
The ATS-04C-20-C1-R0 is a specialized type of heat sink designed for smaller electrical and electronic components. It is a compact and lightweight heat sink made of copper with a thermal resistance of 0.45°C/W.
This heat sink is designed with a high performance heat dissipation system that uses fins and air convection to dissipate heat away from the electrical and electronic components. This is due to the finned structure which increases the total dissipated area, cooling the component more efficiently. Fins also have a unique shape which produces turbulence in the air when the component heats up. This creates air vortices which accelerate the convective heat flow through the fins, cooling the component in a much shorter time.
The ATS-04C-20-C1-R0 is mainly used for high-density surface mounted components, such as those found on printed circuit boards and radio frequency components. It can also be used in applications such as power supplies, automotive electronics, optical storage devices, and LEDs.
The ATS-04C-20-C1-R0 also works exceptionally well in extended temperature range applications, as it is able to withstand temperatures up to 150°C. This makes it suitable for higher power components that require the protection of an efficient heat sink.
Installation for the ATS-04C-20-C1-R0 is simple. The heat sink is attached to a mounting plate or bracket which is then mounted onto the component or board. In some cases, it can also be attached directly to the component or board. Once mounted, the fins should be facing down to ensure optimal air circulation.
Overall, the ATS-04C-20-C1-R0 is an effective heat sink for small electrical and electronic components. Its lightweight construction ensures that it is easy to install and maintain. Additionally, its high thermal conductivity and low thermal resistance make it suitable for even the most demanding applications.
The specific data is subject to PDF, and the above content is for reference