ATS-04C-207-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.37°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are components designed to absorb and dissipate heat from devices or systems. They come in various shapes and sizes depending on the application and type of device. Heat sinks are most commonly used in electronics and computer hardware due to the high levels of heat generated in these components. The primary purpose of a heat sink is to protect the thermal and electrical components from heat damage, as well as to keep them from overheating and burning out.

What is ATS-04C-207-C1-R0?

ATS-04C-207-C1-R0 is a thermal - heat sink which utilizes a copper base and a heat-conductive adhesive to dissipate heat away from the component. The adhesive is made from an epoxy compound to provide superior stability and thermal insulation. The copper base of the heat sink is designed to provide a low thermal resistance to allow for efficient heat transfer. The design also ensures optimal heat dissipation away from the user by using a combination of air gaps and thermal insulation. This ensures that the device is running at optimal temperatures. By utilizing a copper base and adhesive, the heat sink has a high thermal conductivity which makes it ideal for applications which require high thermal impedance.

ATS-04C-207-C1-R0 Application Field and Working Principle

The ATS-04C-207-C1-R0 is suitable for use in a wide range of applications. It can be used as an area heat sink in electronics systems, a CPU heat sink in gaming systems, or a cooling device for LED lights and other types of lighting systems. The working principle of the ATS-04C-207-C1-R0 is based on the passive thermal management method. The heat generated by the device is absorbed by the heat sink which is then dissipated away to the surrounding environment. The high thermal conductivity of the copper base ensures that the heat is quickly and efficiently transferred away from the component and dissipated into the atmosphere. The use of the adhesive also plays a major role in the working principle of the heat sink. The adhesive helps to better distribute the heat evenly throughout the heat sink which allows for more efficient heat dissipation. The heat sink also uses air gaps to further increase the thermal efficiency. The air gaps help to redirect the air flow, allowing for more efficient cooling. The combination of these components leads to the effective cooling of any devices or systems using the ATS-04C-207-C1-R0 as a cooling solution.

Conclusion

The ATS-04C-207-C1-R0 is an effective thermal solution for a wide variety of applications. Its design, which incorporates copper and an adhesive, helps to ensure optimal heat transfer and dissipation away from the device or system. The air gaps and thermal insulation also allow for improved airflow and better cooling. The combination of these features make the ATS-04C-207-C1-R0 a reliable and cost-effective thermal solution for any application.

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