| Allicdata Part #: | ATS-04C-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-04C-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices commonly used in electronics and manufacturing to reduce the temperature of electronic components. ATS-04C-24-C3-R0 is a heat sink used in this type of application. Heat sinks work by transferring heat generated by electronic components away from those components and into the air or an external liquid moving in contact with them.
ATS-04C-24-C3-R0 Application Field
The ATS-04C-24-C3-R0 is primarily used to dissipate heat from one or more electronic components. It is also used in computer and gaming systems, but is best suited for streaming or gaming processors with fast clocks that generate a lot of heat. Additionally, the device is well suited for electronics with high power dissipation such as voltage regulators, and is also suitable for applications where high current flows.
ATS-04C-24-C3-R0 Working Principle
The ATS-04C-24-C3-R0 is a passive heat sink, which means it does not generate any heat to dissipate. Its main purpose is to absorb and quickly dissipate the heat generated by attached electronic components. The device utilizes two different technologies, convection and fin-based cooling, in order to effectively remove large amounts of heat efficiently.
Convection
The first cooling technology used by the ATS-04C-24-C3-R0 is convection. This involves a fan located at the base of the heat sink that circulates air through the fins, which helps transfer heat from the heatsink fins into the air surrounding it. By doing this, the heat is effectively removed from the component, resulting in a cooler system.
Fin-based Cooling
The second cooling technology used by the ATS-04C-24-C3-R0 is fin-based cooling. This involves a highly efficient aluminum fin array which is made of a large number of thin parallel fins. This array increases the surface area of the heat sink, so it is able to dissipate a larger amount of heat more quickly. Additionally, this technology helps to keep air moving around the heat sink so that it is able to cool the component faster.
Conclusion
The ATS-04C-24-C3-R0 is a heat sink designed to dissipate large amounts of heat quickly and efficiently from a wide range of electrical components. It utilizes two innovative cooling technologies, convection and fin-based cooling, to transfer heat away from electronic components and into the air surrounding them. As a result, your components will remain cooler during long or intensive periods of usage, which will help to increase overall system performance and the lifespan of your electrical components.
The specific data is subject to PDF, and the above content is for reference