ATS-04C-37-C2-R0

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Thermal management systems must be implemented in many applications to ensure successful operation and to ensure that system components perform optimally. ATS-04C-37-C2-R0 heat sinks are thermal management solutions specifically designed to meet the needs of high performance electronic systems. By providing robust cooling capabilities, the ATS series helps to ensure that electronic systems remain reliable and free from thermal overload.

The ATS-04C-37-C2-R0 is a copper-based Ni-plated heatsink module that provides superior thermal performance and is ideal for high power applications. It features high-grade extruded aluminum for increased thermal performance, aluminum and nickel-plated copper for increased temperature and corrosion resistance, and a thermally conductive adhesive to ensure secure and effective installation. The surface of the ATS series is coated with a proprietary black anodized finish to minimize reflection of absorbed heat.

The ATS-04C-37-C2-R0 is designed to dissipate the heat generated by electronic components such as processors, GPUs, and FPGAs. The heatsink features an innovative design that maximizes airflow to ensure effective heat transfer to the surrounding environment and also helps to minimize acoustic noise levels. The heatsink has two large fans that circulate air over the finned surface to ensure optimal cooling. The fan speed can be adjusted based on the temperature of the component being cooled, providing reliable and consistent cooling.

The ATS-04C-37-C2-R0 also features a heat pipe design. This feature helps to eliminate hot spots and improve cooling performance. The heat pipe design also helps to ensure that the heat dissipates evenly over the entire surface of the heatsink, resulting in even cooling. This ensures that components remain at optimal temperatures and ensures reliable and consistent system performance.

The ATS-04C-37-C2-R0 also features thermal sensors to monitor temperatures and ensure optimal cooling performance. The cooling requirements can be adjusted based on the temperatures of the specific component being cooled. In addition, the heatsink includes a clip-in backing plate for ease of installation and secure mounting.

In summary, the ATS-04C-37-C2-R0 provides superior thermal performance for high performance electronic systems. By providing robust cooling capabilities, the ATS series helps to ensure that electronic systems remain reliable and free from thermal overload. The heatsink features an innovative design that maximizes airflow to ensure effective heat transfer to the surrounding environment and also helps to minimize acoustic noise levels. The heating pipe design, thermal sensors, and adjustable fan speed allow for reliable and consistent system performance. The attachment and mounting of the heatsink is also designed for ease of application.

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