| Allicdata Part #: | ATS-04C-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-04C-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the operation of a variety of electronic devices, ranging from CPUs, GPUs, and gaming consoles, to servers and other large-scale computing systems. It is thus critical to equip these modules with efficient thermal solutions capable of keeping the components cool even under intense workloads. In this realm, one of the most popular solutions is the ATS-04C-46-C3-R0 heat sink, which has been designed to provide efficient cooling for a variety of computing systems.
The ATS-04C-46-C3-R0 heat sink is an aluminum-finned heat sink featuring a unique pinned fin design. This design ensures maximum surface contact and heat transfer efficiency between the heat sink and the device, providing superior cooling. The simplicity and reliability of the ATS-04C-46-C3-R0 heat sink make it an ideal choice for a wide variety of applications, from standard computers and servers, to enterprise-level systems.
The ATS-04C-46-C3-R0 heat sink utilizes the natural convection process to draw heat away from its source. The heat sink is composed of a metal plate with a series of perforated fin arrays extending from the center. Heat is drawn into the heat sink from the device via thermal gradients. The heat is then transferred to the metal plate by thermal conduction. Once the heat is in the metal plate, it is dissipated into the surrounding environment via natural convection cooling, where the air circulating around the heat sink dissipates the heat.
Aside from its superior performance, the ATS-04C-46-C3-R0 heat sink is also ideal for its small footprint and low cost. The heat sink is highly efficient and provides excellent cooling for even the most demanding of applications. Since it is lightweight and versatile, it is easy to install and relocate, allowing for great flexibility.
The ATS-04C-46-C3-R0 is a perfect choice for any thermal management applications. It is ideal for a variety of applications, from cooling CPUs and GPUs, to server clusters and gaming consoles. Its combination of superior cooling, low cost and small footprint make it an excellent choice for any thermal management system. The ATS-04C-46-C3-R0 is a reliable and efficient heat sink that will ensure that your devices remain cool and perform optimally even under intense workloads.
The specific data is subject to PDF, and the above content is for reference