ATS-04C-63-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-04C-63-C3-R0 Application Field and Working PrincipleThermal - Heat Sinks are devices used to dissipate heat away from sensitive components. Heat sinks are designed to efficiently absorb and disperse the heat generated by electrical components, allowing them to operate in cooler environments. The ATS-04C-63-C3-R0 is one such device and has been designed to meet stringent requirements in order to provide superior cooling performance.ATS-04C-63-C3-R0 Application FieldThe ATS-04C-63-C3-R0 thermal - heat sink is designed for a wide range of applications. It can be used in televisions, computers, gaming systems, projectors and industrial machinery, among others. The ATS-04C-63-C3-R0 heat sink can provide cooling solutions for a wide range of operating temperatures, from -40°C to +110°C.ATS-04C-63-C3-R0 Working PrincipleThe ATS-04C-63-C3-R0 utilizes a finned heatsink to dissipate generated heat. The finned heatsink includes a series of metal fins attached to a heatsink base. The finned heatsink is designed to allow air to flow over it and to absorb and disperse heat from the components connected to it. Heat is dissipated by a combination of convection, conduction, and radiation.The convection process used by the ATS-04C-63-C3-R0 heat sink is a natural flow of air across the finned heatsink. This process allows air to freely flow across the fins, allowing heat to dissipate across the surface of the finned heatsink. This constant flow of air cools the components connected to the finned heatsink, allowing them to operate at lower temperatures.The conduction process is responsible for transferring heat from the electrical components to the finned heatsink. The finned heatsink is designed to increase the amount of surface area available for the transfer of heat, making it more efficient at transferring heat away from the electrical components.The radiation process is when the finned heatsink emits infrared radiation. This radiation helps dissipate heat away from the electrical components, as it does not rely on air to cool the components. The fins also act as a heat sink, absorbing heat and dispersing it away from the electrical components. The ATS-04C-63-C3-R0 utilizes all three processes to provide superior cooling performance. The combination of these three processes allows the heat sink to reduce the temperature of the electrical components connected to it.ConclusionThe ATS-04C-63-C3-R0 is designed to provide superior cooling performance in a range of operating temperatures. Its combination of convection, conduction, and radiation processes enable the device to efficiently dissipate heat away from sensitive components. This product is ideal for a variety of electronics applications, making it an ideal solution for cooling components.

The specific data is subject to PDF, and the above content is for reference