| Allicdata Part #: | ATS-04C-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-04C-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04C-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04C-64-C1-R0 is an integral part of thermal-heat sinks. Thermal-heat sinks are heat transfer components that help to remove the waste heat generated by electronic components, and they typically consist of a finned aluminum base plate to which thermally conductive materials are attached. In this way they create maximum surface area for the fast dissipating of the heat.
The ATS-04C-64-C1-R0 features a finned aluminum base plate, making it suitable for cooling electronics, as well as for providing reliable operation under high shock and vibration conditions. The base plate is covered with a series of dielectric materials that provide insulation and better heat transfer. There is also a thermal pad on the base plate that helps to fill air gaps between it and the component being cooled. This results in increased thermal conductivity, which in turn helps to reduce heat buildup and improve the device\'s overall efficiency.
The working principle behind the ATS-04C-64-C1-R0 is air displacement. The finned design of the base plate allows for large amounts of air to pass through it. The air passes through the fins and then over the components being cooled. The thermal pad on the base plate helps to create a more efficient transfer of heat by filling any air gaps while allowing heat to transfer from the component to the heat sink. As the air passes across the surface of the component, its temperature is lowered, which in turn helps to reduce device temperatures.
The ATS-04C-64-C1-R0 is a popular choice for applications such as LED lighting, power supplies, switching power supplies, and voltage regulator circuits. It is also well suited for applications requiring high operational reliability and extended service life under harsh environmental conditions. Its low cost, easy installation, and ability to be used in a wide variety of applications make it an ideal thermal-heat typical choice for a wide range of applications.
In summary, the ATS-04C-64-C1-R0 is an ideal thermal-heat sink solution for cooling applications that require high reliability and extended service life under harsh environmental conditions. Its finned aluminum base plate allows for efficient air flow to help reduce device temperatures, while its dielectric materials and thermal pad help to create a more efficient heat transfer. Its low cost and easy installation make it an ideal choice for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference