ATS-04C-73-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks Heat sinks are components used to transfer heat away from sensitive or critical components in electronic devices. The ATS-04C-73-C1-R0 is an advanced version of a heat sink for thermoelectric cooling applications that provides a highly efficient thermal interface.The ATS-04C-73-C1-R0 integrates a selective laser mantling process into its manufacturing process to improve the efficiency of thermal transfer. This process enables the device to distribute the thermal energy more efficiently that other conventional heat sinks. The thermal development of the ATS-04C-73-C1-R0 also offers a much larger surface area. This increased surface area helps to increase the rate of heat dissipation even further, creating an efficient thermal interface. Due to the advanced nature of the ATS-04C-73-C1-R0, it is suitable for use in a variety of applications. This includes LED lighting, electric motor control, motor drive applications, high-current switching applications, and other thermal management applications. The device offers an extremely low thermal resistance, also known as a thermal impedance, meaning that it is able to transfer heat away from heat generating components quickly and efficiently. The thermal transfer of the ATS-04C-73-C1-R0 is enabled through its advanced materials. The device’s highly reflective surface helps to dissipate heat effectively, while a thermal conductive layer between the aluminum alloy surface and the silicon substrate helps to transfer the heat away quickly. To ensure maximum thermal performance, the ATS-04C-73-C1-R0 is mechanically fitted over the heat generating components. This helps to remove any air gaps between the component and the heat sink, and further increase the thermal performance of the device. The ATS-04C-73-C1-R0 is supported by a number of useful features. The device can function up to an operating temperature of 120°C. The device also features an electromagnetic interference resistance rating of 20dB, making it suitable for use in electrically noisy environments. It also features an optimal heat transfer SMD mounting pattern that allows for easy and precise assembly. The ATS-04C-73-C1-R0 is an advanced thermal interface suitable for a wide range of thermal management applications. Its highly efficient thermal transfer ensures effective heat dissipation, allowing for sensitive components to remain cool even under high-stress conditions. Its wide range of features make it suitable for use in a variety of applications.

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