ATS-04C-95-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS7982-ND

Manufacturer Part#:

ATS-04C-95-C2-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04C-95-C2-R0 datasheetATS-04C-95-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.37220
10 +: $ 4.25628
25 +: $ 4.02016
50 +: $ 3.78365
100 +: $ 3.54715
250 +: $ 3.31068
500 +: $ 3.07420
1000 +: $ 3.01508
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-04C-95-C2-R0 heat sink is a product from the ATS thermal heat sink line. The product is designed to provide efficient thermal management of electronic components, and is suitable for a wide range of applications, including power systems, communications, and industrial applications. The heat sink is made from a high-grade aluminum alloy and features integrated fins, which increase its surface area to better dissipate heat.

The ATS-04C-95-C2-R0 heat sink is designed to have a higher performance than standard heatsinks. It features a large fin design with improved air flow, which significantly increases its cooling capacity. The heat sink is optimized with a unique fin design and surface finish treatment for improved heat dissipation. The heat sink also has an efficient thermal interface material, which ensures optimal thermal performance.

The ATS-04C-95-C2-R0 heat sink can be used in a variety of applications. It is commonly used in heating, ventilation, and air conditioning systems, as well as in automotive, power electronics, industrial electronics, and automotive LED lighting applications. It can also be used in the design of high-performance cooling systems for computer hardware, as well as for other applications which require an efficient and cost-effective cooling solution.

The ATS-04C-95-C2-R0 heat sink is designed to operate within a wide temperature range, from 0 to 120°C. The heat sink is equipped with an integrated thermal management system, which ensures optimal thermal performance at all times. The integrated design of the heat sink allows for efficient and reliable thermal management and helps reduce the overall cost of maintaining the system, as well as increasing its performance.

The ATS-04C-95-C2-R0 heat sink is designed with a wide heat dissipation range, from 0.014 to 0.21 W/mK. This allows for high thermal performance at low temperatures and provides efficient thermal management even at high temperatures. The heat sink also features a wide range of mounting options, making it suitable for a variety of applications. The product is also designed to be compatible with a wide range of electronic components, allowing for easy integration with existing systems.

The working principle of the ATS-04C-95-C2-R0 heat sink is based on the principle of thermal transfer. Heat is generated within an electronic device, such as a processor, and this heat is then dissipated through the heat sink. The heat sink works to actively transfer the heat away from the electronic device, transferring it to the external environment. By doing this, the heat sink maintains the temperature of the electronic device within its optimal working range, ensuring it works efficiently and effectively.

In conclusion, the ATS-04C-95-C2-R0 heat sink is a high-performance thermal heat sink designed to provide efficient thermal management of electronic components. It features large fins, an efficient thermal interface material, and efficient thermal transfer. The product is suitable for a wide range of applications, including power systems, communications, and industrial applications. It is also designed to operate within a wide temperature range, from 0 to 120°C. The heat sink provides an efficient and cost-effective cooling solution, and is optimized for optimal thermal performance. Lastly, the product works on the principle of thermal transfer, transferring generated heat from the electronic device to the external environment.

The specific data is subject to PDF, and the above content is for reference

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