ATS-04C-98-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

A thermal - heat sink is a device that is designed to manage and dissipate the waste heat produced by various types of electronic components. Thermal - heat sinks are essential for many electronics as they help maintain proper operating temperatures in order to ensure the longevity of the components. The ATS-04C-98-C1-R0 is a type of thermal - heat sink that is designed to be used for industrial applications.

What is the ATS-04C-98-C1-R0 Thermal - Heat Sink?

The ATS-04C-98-C1-R0 is a thermally hardy, dual-conductor, low-profile, heat-dissipating device used in a variety of applications where waste heat is an issue. It is designed to be used in a range of temperatures in order to provide a high level of heat dissipation compared to other standard thermal - heat sinks. The ATS-04C-98-C1-R0 also features an extremely low current leakage that is well suited for energy-sensitive applications. Its wide operating temperature range allows the device to be used in a number of different settings, which is why it is suitable for industrial applications.

Application Field and Working Principle of the ATS-04C-98-C1-R0

The ATS-04C-98-C1-R0 is used primarily in high-heat-flux industrial applications[JM1] , such as those related to power generation and the machinery industry. It is also suited for use in small-scale electronic systems, such as telecommunications and data storage. The ATS-04C-98-C1-R0 is designed to manage and dissipate heat through a combination of conductive and convective processes.The device is comprised of two components that work together to transfer heat away from the component or system that is generating it. The first component is a base plate that is made from a highly-conductive material, such as aluminum, copper, or a combination of both. This material is designed to dissipate heat away from the component or system that is generating it. The second component of the device is the thermal - heat sink which is a large, flat component that is typically either made of aluminum or copper. This component is connected to the base plate and is designed to transfer heat away from the component or system by utilizing a combination of conductive and convective heat transfer.The ATS-04C-98-C1-R0 is designed to transfer heat away from the component or system through convection or conduction. Convection is the process of heat being conducted away from the source due to the movement of air or fluid. This is achieved by placing the thermal - heat sink at an area with higher-velocity air or fluid which increases the rate of heat transfer. Conduction is achieved by the direct transfer of heat from the component or system to the base plate, and then on to the thermal - heat sink. This transfer of heat is facilitated by the use of an efficient material such as aluminum or copper.

Conclusion

The ATS-04C-98-C1-R0 is a type of thermal-heat sink designed to be used for industrial applications. It is designed to manage and dissipate heat through both conductive and convective processes and is well-suited for use in both small-scale and industrial applications. The efficiency of the device is achieved through the use of high-conductive materials such as aluminum or copper and a combination of convection and conduction. As such, the ATS-04C-98-C1-R0 is essential for ensuring the longevity of any components or systems where heat management is of paramount importance.

The specific data is subject to PDF, and the above content is for reference