ATS-04D-100-C1-R0

Thermal - Heat Sinks are designed to dissipate the heat generated by an electronic device or component to ensure efficient operations. ATS-04D-100-C1-R0 is a thermal management device or component used to disperse heat. It is usually mounted on a thermal sink, which acts as a stationary base to absorb and retain heat from the device or components. The ATS-04D-100-C1-R0 uses a copper core and four copper pipes to conduct heat away from the device and dissipate it to the atmosphere.

Application Field

The heat sinks are used for various applications such as; soldering, power amplifiers, computer processors, and similar electronics and components that tend to generate large amounts of heat. The thermal sink is designed to provide dissipating air currents to remove the heat generated by the device or component, thus avoiding its heating and failure.

The ATS-04D-100-C1-R0 is also suitable for a range of hard-to-reach fixtures and components. This is due to its small size and minimal space requirement. It can also operate at a wide range of temperatures, making it ideal for environments where temperatures fluctuate often. The device is also energy-efficient, as it uses minimal power to generate a high amount of heat output.

Working Principle

The ATS-04D-100-C1-R0 use a combination of metalized thermal surfaces and ceramic structures to absorb and disperse heat. The copper core consists of four pipes which carry heat away from the source. A fan is also included inside the casing which directs airflow to further dissipate the heat. The air is also flowed into the center of the device where it is heated and exchanged for colder air.

Meanwhile, the ceramic structures provide better thermal conduction and allow better heat transfer from the device or component to the outer surface of the casing where a large area radiator dissipates the heat. The convenient design ensures that the device heats up faster, cools faster and works with high efficiency.

The ATS-04D-100-C1-R0 heatsink is not only an effective way to manage the temperature of your electronic components or devices, but also provides a reliable and robust solution for any application.