| Allicdata Part #: | ATS-04D-105-C1-R1-ND |
| Manufacturer Part#: |
ATS-04D-105-C1-R1 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-105-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal and Heat Sinks are complex yet indispensable components of various electronic applications. In these applications, heat sinks are typically used to transfer heat away from components in order to reduce their operating temperatures. The ATS-04D-105-C1-R1 is a dependable and efficient thermal and heat sink, and is used frequently in the industry.
This particular heat sink is primarily used to dissipate heat from high-power electronic components, such as power transistors and heating transistors. It can also be used in applications where a high degree of thermal dissipation is required. The heat sink is made from high-quality aluminum and features a unique design, consisting of fins and a fan that help to quickly and effectively dissipate heat. The fan is included in the heat sink package, and has a diameter of 105 mm, which helps to achieve excellent cooling performance.
The ATS-04D-105-C1-R1 is a reliable and efficient thermal and heat sink, and features an easy to use mounting system. The unique design of the heat sink allows it to be easily mounted onto a variety of different electronic components. This makes it a great choice for applications where a reliable and efficient thermal and heat sink is required. Additionally, the ATS-04D-105-C1-R1 is designed to be used in extremely tight spaces, such as power module packages.
The working principle of the ATS-04D-105-C1-R1 is based on the concept of thermal energy transfer. This concept states that any material or device that is exposed to a temperature gradient will attempt to dissipate its thermal energy until a state of thermal equilibrium is reached. The fins and fan on the heat sink work together to help accelerate this process. The fins absorb the thermal energy from the component and transfer it to the fan, which then forces ambient air across the fins. This forced air then carries the thermal energy away from the component, and out of the device.
The ATS-04D-105-C1-R1 is a reliable and efficient thermal and heat sink that is widely used in a variety of applications. From providing improved thermal performance in power transistors and heating transistors, to dissipating heat in extremely tight spaces, the ATS-04D-105-C1-R1 is an indispensable component that can be used in a wide range of applications. This thermal and heat sink is designed with thermal transfer in mind, and is equipped with a fan and fins that can quickly and effectively dissipate heat away from components, allowing them to perform at their optimal level.
The specific data is subject to PDF, and the above content is for reference