| Allicdata Part #: | ATS-04D-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-04D-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of passive cooling system that is used to transfer the heat generated by electronic devices to the surrounding air in order to keep them operating within safe temperature limits. The use of heat sinks is becoming ever more important as the power levels of modern electronic components continue to increase. The ATS-04D-110-C3-R1 is a popular heat sink that has been designed to combat the increasing thermal challenges associated with modern electronics.
Description of the Heat Sink
The ATS-04D-110-C3-R1 Heat Sink is a ferrous alloy thermal solution consisting of a heat transfer plate, sealed with thermally conductive oxide, to dissipate the heat to the surroundings. The heat transfer plate is connected to a heat dissipating fin structure, which is designed to increase the surface area available for heat dissipation. The extruded finned aluminum body of the heat sink increases air circulation around the internal plate for improved thermal efficiency. The ATS-04D-110-C3-R1 Heat Sink also features a snap-in clip system for easy assembly and secure mounting.
Application Field and Working Principle
The ATS-04D-110-C3-R1 Heat Sink is primarily used in applications where there is a need for high-temperature thermal management. Heat sinks are used in many electronic devices, such as computers, servers, mobile devices, and other electronic circuits. By dissipating the heat generated by the device, heat sinks help to maintain the operating temperature of the device within safe levels.
The working principle of a heat sink is fairly straightforward. Heat sinks are designed with a large surface area that can effectively absorb the heat generated by a device. The heat is eventually dissipated to the surrounding air. Heat sinks usually consist of an array of fins that can increase the surface area available for heat dissipation. The fins also create a larger air gap between the device and the heat sink, allowing for more effective heat transfer.
Conclusion
Heat sinks are a vital piece of equipment in the thermal management of electronic devices and circuits. The ATS-04D-110-C3-R1 Heat Sink is a popular heat sink that has been designed to combat the increasing thermal challenges associated with modern electronics. This heat sink features a lightweight finned aluminum body, and a snap-in clip system for easy assembly and secure mounting. Heat sinks are a simple and cost-effective way to ensure that electronics maintain safe operating temperatures.
The specific data is subject to PDF, and the above content is for reference