| Allicdata Part #: | ATS-04D-126-C3-R0-ND |
| Manufacturer Part#: |
ATS-04D-126-C3-R0 |
| Price: | $ 4.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-126-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.67794 |
| 30 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04D-126-C3-R0 is one of the most popular heat sinks nowadays because of its superior performance, reliability and long service life. The unique design of the ATS-04D-126-C3-R0 includes a corrosion-resistant stainless steel inner shell, a high-efficiency micro-profile fin array, and a built-in air baffle that improves air circulation within the heat sink. The air baffle also helps to reduce resistance to airflow and helps to keep the internal temperatures low.
The ATS-04D-126-C3-R0 has a range of applications in the thermal management of electronics components. It is particularly suited for applications in high power consumption components, such as CPUs, GPUs, and video cards. Its superior thermal performance and reliability make it an ideal choice for use in mission-critical applications.
The ATS-04D-126-C3-R0 works on the principle of convection and radiation. The heat from the components is conducted through the heat sink fins and is then radiated into the surrounding environment. The rate at which heat is transferred to the surrounding environment is determined by the rate of air circulation and the surface area of the fins. The fins themselves also have the ability to absorb and store the heat energy, while the air baffle further aids in heat dissipation by increasing the rate of airflow across the fins.
In conclusion, the ATS-04D-126-C3-R0 is an effective thermal - heat sink component that is designed to efficiently dissipate heat from electronic components. It is a reliable and long-lasting component that is ideal for applications in mission-critical systems. Its unique design and principle of operation make it capable of dissipating heat from high power-consuming components without affecting the performance of other surrounding components.
The specific data is subject to PDF, and the above content is for reference