ATS-04D-130-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04D-130-C1-R0-ND

Manufacturer Part#:

ATS-04D-130-C1-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04D-130-C1-R0 datasheetATS-04D-130-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.56265
30 +: $ 3.36462
50 +: $ 3.16676
100 +: $ 2.96881
250 +: $ 2.77089
500 +: $ 2.57297
1000 +: $ 2.52349
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are used in a wide variety of applications, most notably in electronic and electrical components. The main purpose of these devices is to divert and dissipate heat away from the components and reduce their operating temperatures, preventing possible damage to the parts.

The ATS-04D-130-C1-R0 thermal heat sink is a device that uses a combination of cooling fins and a type of fan called a "rotor" to create a continuous air flow around a device. The heat is taken away from the part and released out of the fins of the device, keeping the heat sink cooler than the component so it can effectively dissipate the heat away without affecting its performance.

Application Field

The ATS-04D-130-C1-R0 thermal heat sink is used in a wide range of industries, including automotive, IT, telecommunications, and industrial electronics. It is most commonly used on components such as voltage regulators, CPUs, power amplifiers, and switching power supplies. All of these types of components generally produce a large amount of heat, and the thermal heat sink helps to reduce the temperature of these components and keep them from failing.

The ATS-04D-130-C1-R0 thermal heat sink is often used in combination with other cooling methods such as water cooling, air cooling, and heat spreading sheets. By combining these devices, the thermal heat sink can effectively disperse heat faster, keeping the component cooler and reducing the risk of overheating.

Working Principle

The ATS-04D-130-C1-R0 thermal heat sink is composed of several components, all of which work together to keep heat away from a component. The rotor, which is the fan component of the device, works by creating a continuous airflow over the cooling fins. This airflow helps to move the heat away from the component and out through the fins. The heat is then dissipated into the surrounding air.

The cooling fins of the ATS-04D-130-C1-R0 thermal heat sink are what actually help to dissipate the heat away from the component. The fins create a large surface area to dissipate the heat, and because they are made from a material such as aluminum or copper, they are very effective at conducting heat away from the component.

The ATS-04D-130-C1-R0 thermal heat sink is an effective and efficient way to reduce the temperature of components, reducing the risk of damage and failure due to overheating. By combining the cooling fins and the rotor, the device is able to keep components running cooler and more reliably for a longer period of time.

The specific data is subject to PDF, and the above content is for reference

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