| Allicdata Part #: | ATS-04D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-04D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a vital role in the successful operation of any modern electronics system. Heat generated by electronic components needs to dissipate quickly to ensure that the system remains operable, reliable, and safe. ATS-04D-139-C1-R0 is a type of Heat Sink, which is often used for the cooling of electronic systems and components. This document will discuss the application field and working principle of ATS-04D-139-C1-R0.
Heat sinks are typically constructed from a range of materials such as aluminum, copper, and special alloys. The ATS-04D-139-C1-R0 is constructed from aluminum which gives it excellent heat transfer and thermal conductivity characteristics. Its compact design and size, coupled with its light weight make it ideal for use in confined spaces.
ATS-04D-139-C1-R0 Heat Sinks are a popular choice for cooling components such as processors, FPGAs, ASICs, memory modules, and other high-power components. They are perfect for a wide range of applications, including server systems, industrial equipment, telecom systems, medical equipment, and much more.
The working principle of ATS-04D-139-C1-R0 Heat Sinks is based on the concept of convection. Heat generated by the electronic components is transferred to the heat sink through conduction. This heat is then dissipated into the surrounding environment via convection, or transferred to a cooling source such as a fan or liquid cooling system.
Heat sink designs often also feature a tight fin pitch which prevents any need for airflow in order to transfer the heat away from the components. The aluminum material used in the construction of the ATS-04D-139-C1-R0 further enhances its ability to efficiently dissipate the heat away from the components.
A further useful feature of the ATS-04D-139-C1-R0 is its ability to be mounted in the standard hole and stud arrangements which makes it easy to install in a variety of locations within the system. This further increases its versatility and usability across a wide range of electronics systems and components.
In conclusion, the ATS-04D-139-C1-R0 Heat Sink is a popular choice, due to its versatile design, robust construction, and effective heat dissipation. It is ideal for the cooling of a variety of electronic systems and components, and offers an efficient alternative to other forms of thermal management.
The specific data is subject to PDF, and the above content is for reference