ATS-04D-148-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to Thermal - Heat Sinks and ATS-04D-148-C1-R0

Thermal - Heat Sinks are essential components in many electronic systems and devices. They are designed to dissipate heat and regulate the temperature of electronics safely and efficiently. This helps to ensure the longevity of electronic devices and prevent them from experiencing performance issues due to overheating. Heat sinks are widely used in various applications, ranging from consumer electronics, telecoms, medical electronics, and industrial equipment.The ATS-04D-148-C1-R0 is a thermal heat sink designed for use on TV panels, power amplifiers, and other electronics. It features a double-sided thermal radiator, a metal-clad heatsink, and a high-density fin that is designed for efficient heat dissipation. This allows the ATS-04D-148-C1-R0 to be an effective solution for keeping electronic systems running cool and prolonging the life of their components.

Application Field of Thermal Heat Sinks

Thermal - Heat Sinks are used in various applications across different industries. They are commonly used in computers, consumer electronics, telecommunications, medical electronics, and industrial equipment.Computer components such as processors, graphics cards, and motherboards are frequently equipped with Thermal - Heat Sinks for efficient heat dissipation and temperature control. Consumer electronics like TVs, cell phones, and sound systems also have heat sinks to ensure that they operate within a safe temperature range.Thermal - Heat Sinks are also widely used in the telecoms and medical electronics industries. In telecommunications, they are deployed to protect radio transmitters, receivers, and amplifiers from heat buildup caused by high-frequency transmission signals. Meanwhile, in medical electronics, heat sinks are used to ensure the proper functioning of medical imaging components and keep them from overheating in long-term use.

Working Principle of the ATS-04D-148-C1-R0

The ATS-04D-148-C1-R0 is a thermal heat sink designed for cooling TV Panels, power amplifiers, and other electronics. It features a metal-clad double sided thermal radiator and a high-density fin designed for efficient heat dissipation. The double-sided thermal radiator helps to dissipate heat from the sides of the heat sink, while the fin disperses heat from the top of the heat sink.The ATS-04D-148-C1-R0 has an optimized structure which allows it to provide efficient heat dissipation and a low noise operation. This heat sink also features a patented Heat Pipe# Technology, which enables it to quickly dissipate heat from the hot component and move it away from the device.In addition, the ATS-04D-148-C1-R0 is equipped with a 3-pin connector which allows it to be easily connected to a PCB. This helps to ensure a secure and reliable connection between the heat sink and the motherboard.

Conclusion

Thermal - Heat Sinks are essential components for many electronics systems and devices. They are designed to efficiently dissipate heat and regulate temperature, extending the life of components and ensuring reliable performance. The ATS-04D-148-C1-R0 is a thermal heat sink designed for cooling TV panels, power amplifiers, and other electronics. It features a metal-clad double sided thermal radiator and a high-density fin for efficient heat dissipation. In addition, the ATS-04D-148-C1-R0 is equipped with a 3-pin connector to ensure a secure connection with the motherboard.

The specific data is subject to PDF, and the above content is for reference