
Allicdata Part #: | ATS-04D-179-C1-R0-ND |
Manufacturer Part#: |
ATS-04D-179-C1-R0 |
Price: | $ 3.70 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X30MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.36420 |
30 +: | $ 3.27348 |
50 +: | $ 3.09154 |
100 +: | $ 2.90972 |
250 +: | $ 2.72785 |
500 +: | $ 2.63691 |
1000 +: | $ 2.36412 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management plays an important role in many applications such as electronics, telecommunications and automotive. Heat sinks are one of the most popular thermal management solutions and can be used to dissipate heat generated from electronic components. The ATS-04D-179-C1-R0 is a type of heat sink that provides efficient thermal management and can be used for a variety of applications. In this article, we will discuss the application fields and working principle of the ATS-04D-179-C1-R0.
The ATS-04D-179-C1-R0 is a versatile and efficient heat sink providing high performance thermal management for many applications. It is made from extruded aluminum and has a one-piece fin structure with an integrated base plate design for optimal heat dissipation. The heat sink features an innovative design with advanced heat dissipation technology, making it an ideal thermal solution for applications including consumer electronics, automotive, LED lighting, industrial, and telecom. In addition, the heat sink is designed for use in a wide range of environments and can be used both in indoor and outdoor applications.
The ATS-04D-179-C1-R0’s working principle is based on the laws of thermodynamics. Heat is transferred from the heat source (such as an electronic component) to the heat sink via radiation, convection, and conduction. The heat sink absorbs the heat from the source and dissipates it into the atmosphere with the help of fins, which increase surface area for air flow and provide additional cooling. Airflow generated by a fan or natural convection increase the efficiency of the heat sink. The air flow passes through the fins and transports the heat away from the heat source and into the atmosphere. The heat sink also uses specialized thermal interface materials, such as thermal pads, to maximize the heat transfer from the heat source.
The ATS-04D-179-C1-R0 is a highly efficient heat sink with a variety of applications. It is designed for use in a wide range of environments, making it an ideal thermal management solution for many applications. In addition, the heat sink’s working principle is based on the laws of thermodynamics and it uses specialized thermal interface materials to maximize the heat transfer from the heat source. The ATS-04D-179-C1-R0 is a reliable and cost-effective solution for providing efficient thermal management.
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