| Allicdata Part #: | ATS8093-ND |
| Manufacturer Part#: |
ATS-04D-188-C2-R0 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-188-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.18320 |
| 10 +: | $ 4.07169 |
| 25 +: | $ 3.84527 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology has been around for a long time now, and one of the most popular products in the field is the ATS-04D-188-C2-R0 heat sink. This design has been a standard choice for many applications requiring high levels of thermal management, and it is used in all sorts of products from medical equipment to gaming consoles.
The ATS-04D-188-C2-R0 heat sink is designed to be an open-ended, lightweight aluminum radiator solution with a high level of thermal conductivity. In essence, this product works by transferring the heat generated by the equipment being used away from the component, and into the air around the device. This allows the equipment to remain cool and running efficiently, thus reducing the overall risk of overheating.
The design of the ATS-04D-188-C2-R0 heat sink features a very simple but effective approach to maximizing the thermal cooling performance of the component. It uses a combination of convection and conduction to transfer the heat away from the device. Convection is the transfer of heat through the air, whereas conduction is the transfer of heat through a solid-state material. In this product’s case, the conduction is done by the aluminum core of the heat sink, and the convection is done by the air contained within the heat sink itself.
The ATS-04D-188-C2-R0 is designed with a number of ventilation channels in order to maximize both the convection and conduction properties of the product. These ventilation channels allow for more efficient cooling by allowing the air to be circulated around the outer surface of the heat sink, thus transferring the heat away from the core. The design also includes a number of fins that help to create the necessary turbulence in the air inside the heat sink, which helps to further maximise the convection cooling capabilities of the product.
The ATS-04D-188-C2-R0 is a great choice for many different applications that require high-performance thermal management. It is made out of lightweight aluminum, making it ideal for applications that require portability and space-saving. It is designed with a number of features that can help to make the thermal management of the device more efficient. It can be used in a variety of applications, including medical equipment, gaming consoles, laptop computers, and other products where thermal management is of the utmost importance.
Overall, the ATS-04D-188-C2-R0 is an ideal choice for anyone looking for an open-ended, lightweight aluminum heat sink solution with a high level of thermal conductivity. The design is simple but effective, and its combination of convection and conduction cooling capabilities make it an excellent choice for many different applications. It is a great choice for anyone who needs a reliable and efficient thermal management solution for their device, and it is sure to be a product that stands the test of time.
The specific data is subject to PDF, and the above content is for reference