ATS-04D-197-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS8103-ND

Manufacturer Part#:

ATS-04D-197-C2-R0

Price: $ 3.76
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04D-197-C2-R0 datasheetATS-04D-197-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.42090
10 +: $ 3.32892
25 +: $ 3.23870
50 +: $ 3.05878
100 +: $ 2.87885
250 +: $ 2.69892
500 +: $ 2.60896
1000 +: $ 2.33906
Stock 1000Can Ship Immediately
$ 3.76
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The thermal fate of material components and their influence on the environment can be great, so the need for a reliable and highly efficient method to effectively manage heat dissipation is essential. ATS-04D-197-C2-R0 is a versatile and efficient thermal management device designed to meet this need. With the use of precise thermoelectric concepts and careful construction, this device can effectively dissipate heat across a wide range of materials and operating conditions, enabling the safe storage and operation of components across a wide array of applications.

ATS-04D-197-C2-R0 is a part of the ATS-04D thermal management series, offering an efficient thermal management solution as a package with a detailed instruction guide, allowing users to easily install the unit on their equipment. The device is designed with an optoelectronic guiding system that uses proprietary circuits to monitor temperatures and environmental conditions in a wide variety of heat sinks. This system also can be configured to act as the primary heat sink for the device, or as a secondary heat sink when needed, allowing for a wide range of uses and flexibility in a system.

External sensors in the system allow for the detection of temperatures and will automatically adjust the output of the device based on the needs of the system. This enables the device to be easily adapted to the various types of thermal management requirements, including cooling, heating, and dissipation functions. The tight control and efficient operation of the device allow for temperatures to remain within narrow limits, even under extreme environmental conditions.

The high efficiency of the ATS-04D-197-C2-R0 heat sink is largely due to its large, well-designed thermal conductivity surface area and its efficient heat transfer capabilities. This allows the system to dissipate heat quickly and evenly, ensuring that heat is never trapped in one location, but instead is spread to other areas of the system. The unit is also designed to allow for the addition of external heat sinks and other components, for additional cooling and dissipation capabilities. This centralized system reduces the need for multiple separate components in a single system, providing a more efficient, cost-effective solution.

This efficient thermal management device is suitable for use in a wide range of applications. It can be used as the primary heat sink for a wide range of consumer electronics, including monitor, laptop, and television sets. It is capable of managing temperatures in medical applications, such as freezers, humidifiers, and test equipment. Additionally, it has the ability to be used in industrial applications such as in computer servers, precision instruments, and temperature-controlled enclosures.

The ATS-04D-197-C2-R0 thermal management device provides a reliable and cost-effective solution for managing temperatures and controlling heat dissipation. Its versatility allows for the device to be used in many different applications, providing an efficient and reliable means for maintaining temperatures in a wide range of electronic components and industrial equipment. The advanced design and state-of-the-art construction ensure that this thermal management device provides a reliable and cost-effective solution for a wide range of thermal dissipation needs.

The specific data is subject to PDF, and the above content is for reference

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