ATS-04D-20-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are thermal management components used to keep electronics components cool through conduction or convection heat transfer. ATS-04D-20-C1-R0 is a thermal-heat sink that can be used to dissipate heat generated from electronics components. It has high efficiency and can be used in a variety of applications. The following article will discuss the application field and working principle of the ATS-04D-20-C1-R0 thermal-heat sink.

Application Field of ATS-04D-20-C1-R0 Heat Sink

AT-04D-20-C1-R0 Heat Sinks are designed for use with both conduction and convection heat transfer. It can be used for applications such as computer CPU cooling, server cooling, and other cooling applications.The ATS-04D-20-C1-R0 Heat Sink is constructed with a copper base for optimal heat dissipation. The aluminum fins are designed with a low thermal resistance and high thermal capacity. The thermal resistance of the ATS-04D-20-C1-R0 Heat Sink is 0.03°C/W. The heat sink has a maximum power rating of 40 W and is designed to be used with temperatures ranging from -55°C to 200°C.The ATS-04D-20-C1-R0 Heat Sink is an ideal choice for a variety of thermal management applications. It is designed to be used in harsh environments and provides excellent heat transfer and thermal efficiency.

Working Principle of ATS-04D-20-C1-R0 Heat Sink

The ATS-04D-20-C1-R0 Heat Sink is designed with a copper base and aluminum fins. The copper base has an excellent heat conductivity which rapidly transfers heat away from the electronic components. The aluminum fins on the heat sink maximize heat dissipation by rapidly dissipating the heat outwards into the surrounding environment.The thermal resistance of the ATS-04D-20-C1-R0 Heat Sink is 0.03°C/W, providing a high level of thermal efficiency for the device. The fins on the heat sink are designed to generate a maximum flow of air around the device to ensure it is cooled adequately. The heat sink also has a maximum power rating of 40 W and can be used with temperatures ranging from -55°C to 200°C.

Conclusion

The ATS-04D-20-C1-R0 Heat Sink is a thermal-heat sink that can be used for a variety of applications. It is constructed with a copper base to ensure optimal heat transfer and has aluminum fins that improve the thermal efficiency of the device. The maximum power rating of the ATS-04D-20-C1-R0 is 40 W, and it can be used in a temperature range of -55°C to 200°C. The thermal resistance of the ATS-04D-20-C1-R0 is 0.03°C/W, providing an excellent level of thermal efficiency.

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