| Allicdata Part #: | ATS-04D-22-C1-R0-ND |
| Manufacturer Part#: |
ATS-04D-22-C1-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-22-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management plays an important role in modern technologies, from industrial to consumer electronics. Effective heat management is essential for devices that need to stay within an optimal temperature range while providing efficient performance and maximum lifespan. The ATS-04D-22-C1-R0 is a high-performance, ultra-slim thermal heat sink designed to dissipate heat quickly and reliably, offering exceptional performance and value.
The ATS-04D-22-C1-R0 is a high-efficiency thermal dissipation solution that can be used for a range of device and system applications. It is constructed from a thermally superior (low thermal expansion) and highly-conductive alloy material, and has a very low thermal resistance. The cooling fins are machined to provide maximum air dissipation around the heating element even in confined spaces, making it suitable for the smallest devices.
The ATS-04D-22-C1-R0 is used predominantly as a heat sink for cooling electronic components, but it can also be employed for other purposes including heat spreading from a heat source to create an even temperature profile and cooling the air around the component. This makes it ideal for computer processors, graphics cards, circuit boards and other components that generate a lot of heat.
In terms of operation, the ATS-04D-22-C1-R0 works by transferring heat from the heat-generating component to the cooler air around it, thus reducing the temperature of the heat-generating component. The system works on the principle of forced convection, wherein air heated by the component is removed rapidly, while cold air is brought in to cool it down. This means that more heat is removed from the component, keeping it cool even when running at high frequencies. The fins also help to increase the surface area to increase heat dissipation from the component.
The ATS-04D-22-C1-R0 is a highly effective cooling solution for a variety of applications, including embedded systems, aerospace, gaming, media centers, automotive electronics, and more. It is designed to ensure that your devices stay within the optimal temperature range, and that you get the best performance from the components, as well as ensuring maximum lifespan.
The specific data is subject to PDF, and the above content is for reference