| Allicdata Part #: | ATS8121-ND |
| Manufacturer Part#: |
ATS-04D-24-C2-R0 |
| Price: | $ 5.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any electronic component, and understanding the specifics of individual heat sinks is important for ensuring that components are able to operate at their best. The ATS-04D-24-C2-R0 is an effective heat sink that is capable of providing optimal heat dissipation for a range of components. This article will explore the application fields and working principle of this heat sink.
Application Field
The ATS-04D-24-C2-R0 is designed for use in a range of integrated circuit boards, including those that in the IoT, AI, and automotive sectors. The heat sink is capable of providing effective heat dissipation in temperatures ranging from -55°C to 105°C, making it suitable for many temperature-sensitive circuit boards and components. This makes the ATS-04D-24-C2-R0 an ideal choice for high performance applications that require efficient thermal management. Additionally, the heat sink is designed to be easy to install, even in tight spaces, thanks to its clip-on mounting system. This makes it an ideal choice for applications where time and space are limited.
Working Principle
The ATS-04D-24-C2-R0 is designed to efficiently dissipate heat produced by circuit boards and components. It does this by using a combination of conduction and convection. Convection dissipates heat by circulating the air around the heat sink, while conduction transfers heat directly to the heat sink. The thermal pad between the heat sink and the component helps to ensure that the heat generated by the component is efficiently transferred to the heat sink. This helps to keep the components cool even under high performance conditions.
The ATS-04D-24-C2-R0 is also designed to be highly reliable and durable. It is made of a lightweight aluminum alloy that is resistant to corrosion, making it suitable for long-term use. Additionally, the heat sink is designed to be highly efficient, reducing the energy that is required to dissipate heat while still providing reliable thermal management for components. This helps to make it an ideal choice for a range of applications.
Conclusion
The ATS-04D-24-C2-R0 is an effective and efficient heat sink that is designed for use in a range of integrated circuit boards and components. It is capable of providing effective thermal management in temperatures ranging from -55°C to 105°C, and is designed to be easy to install even in tight spaces. It is also designed to be highly reliable and durable, and is capable of efficiently dissipating heat using a combination of conduction and convection. This makes it an ideal choice for a range of applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference