| Allicdata Part #: | ATS-04D-26-C3-R0-ND |
| Manufacturer Part#: |
ATS-04D-26-C3-R0 |
| Price: | $ 6.90 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-26-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.21117 |
| 30 +: | $ 5.86635 |
| 50 +: | $ 5.52119 |
| 100 +: | $ 5.17614 |
| 250 +: | $ 4.83106 |
| 500 +: | $ 4.48599 |
| 1000 +: | $ 4.39972 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been a great concern of designers and engineers since the advent of modern computing and high tech electronics. This applies to the management of power dissipated by the components and the required cooling of electronics. In order to achieve the best performance of the components, it is essential to provide the correct thermal designs. Thermal design consists of two parts: the heat sink and the thermal interface material.
The ATS-04D-26-C3-R0 is a passive heat sink that is primarily used to dissipate heat from small to moderately large surface-mount and through-hole components. It is widely used in the cooling of chips in the fields of power electronics, communication circuits, and digital circuits.
The heat sink is composed of a metal body with high thermal conductivity. The body is made of aluminum and has a natural oxidation film that provides excellent resistance to corrosion. The structure of the heat sink also allows it to dissipate heat more efficiently due to its fin design.
The ATS-04D-26-C3-R0 heat sink is also equipped with a thermal interface material that helps in more efficient thermal transfer from the component to the heat sink. The thermal interface material is an advanced silicone-based material that is able to fill in the microscopic imperfections between the heat sink and the component to reduce heat losses.
The heat sink is usually attached to the component using a suitable adhesive that bonds the two parts together. The adhesive is important as it also helps to distribute the heat generated by the component to the heat sink.
When the component is in operation, heat is generated due to the current passing through the component. This heat is transferred from the component to the heat sink. The aluminum body of the heat sink dissipates the heat from the component over a large surface area, thereby reducing the temperature of the component.
The ATS-04D-26-C3-R0 heat sink is a highly efficient passive heat sink that helps to effectively dissipate heat from small to medium sized electronic components. It is a very cost-effective and reliable solution for many applications and can be used in a wide range of temperatures. The heat sink is also equipped with a thermal interface material that further enhances its performance by reducing heat losses.
The specific data is subject to PDF, and the above content is for reference