ATS-04D-36-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.81°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-04D-36-C1-R0

ATS-04D-36-C1-R0 is a thermal-heat sink designed for efficient heat dissipation and can be used in a variety of applications. It is designed to work with both air-cooled and liquid-cooled cooling systems. It features a high-efficiency extruded aluminum construction with a standard black anodizing finish which offers superior corrosion resistance. The design also features a wide selection of mounting holes and brackets for easy installation. In addition, ATS-04D-36-C1-R0 includes a built-in copper heat pipe which can be used to reduce ambient temperature.

Applications of ATS-04D-36-C1-R0

The ATS-04D-36-C1-R0 is well-suited for cooling electronic components such as CPUs, GPUs, high-performance GPUs, and other parts of the computer system. In addition, it can also be used for industrial and commercial applications such as LED lighting, heating and cooling systems, and automotive electronics. ATS-04D-36-C1-R0 is also suitable for applications that require higher airflow such as in gaming consoles and other high-performance electronic devices.

Working Principle of ATS-04D-36-C1-R0

The ATS-04D-36-C1-R0 works by pulling heat away from the components and dispersing it into the surrounding airflow. The heat sink uses a highly efficient extruded aluminum construction that maximizes the surface area for superior thermal performance. The heat sink features wide air channels that can provide up to four times the airflow as compared to standard heat sinks. It also includes a built-in copper heat pipe that can reduce ambient temperatures in some applications. The thermal design of the ATS-04D-36-C1-R0 optimizes the thermal transfer between the heat sink and components. The heat sink features a large fin array that increases the effective cooling area. The fins are designed to dissipate heat quickly and efficiently to the surrounding air. It also includes a unique pin design that improves the cooling performance and ensures the uniform distribution of heat throughout the heat sink.

Conclusion

The ATS-04D-36-C1-R0 is designed for efficient heat dissipation and is suitable for many applications, including LEDs, heating and cooling systems, automotive electronics, high-performance GPUs, gaming consoles, and other high-performance electronics. Its wide selection of mounting holes and brackets make it easy to install and it features a highly efficient extruded aluminum construction that maximizes the surface area for superior thermal performance. The fins and pin design help to ensure uniform distribution of heat throughout the heat sink while the built-in copper heat pipe reduce ambient temperatures in some applications.

The specific data is subject to PDF, and the above content is for reference