| Allicdata Part #: | ATS-04D-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-04D-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04D-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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。Thermal management is an important consideration for electronics equipment as it can impact the equipment’s performance, reliability, and lifespan. In keeping with this in mind, the ATS-04D-50-C3-R0 is a specialized heat sink intended for use in cooling fan assemblies. The ATS-04D-50-C3-R0 is one of the most reliable and efficient heat sinks available, and this article will discuss its application field and working principle.
Application Field
The ATS-04D-50-C3-R0 is designed for use as a heat sink in cooling fan assemblies. Its wide range of heat dissipation makes it suitable for a variety of applications from PCs to consumer electronics like TVs. The ATS-04D-50-C3-R0 is also designed to be extremely efficient, which means that it can dissipate large amounts of heat while ensuring a low profile. As a result, it is an ideal choice for cooling fan systems with limited space.
Working Principle
The ATS-04D-50-C3-R0 operates by transferring heat away from the equipment it is cooling. The heat sink’s design utilizes a number of fins, which are thermally conductive surfaces that aid in the transfer of heat. The fins are arranged in a radial pattern, which promotes the efficient transfer of heat away from the equipment. The ATS-04D-50-C3-R0 also features a base plate for direct contact with the equipment, which helps to dissipate even more heat.
In addition, the ATS-04D-50-C3-R0 is specially designed to reduce its impact on surrounding components. The reducing impact is achieved using a range of technologies that ensure low frictional resistance over the surface of the heat sink. This helps to reduce the likelihood of the heat sinking spreading to other equipment in the vicinity.
Conclusion
The ATS-04D-50-C3-R0 is a specialized heat sink designed for use in cooling fan assemblies. Its wide range of heat dissipation makes it suitable for a variety of applications from PCs to consumer electronics like TVs. The ATS-04D-50-C3-R0 operates by transferring heat away from the equipment it is cooling, using a mixture of thermal conductive-surfaced fins and a base plate for direct contact with the equipment. Additionally, the ATS-04D-50-C3-R0 is designed to minimize its impact on surrounding components, providing improved thermal management. As such, the ATS-04D-50-C3-R0 is an ideal choice for cooling fan systems with limited space.
The specific data is subject to PDF, and the above content is for reference