ATS-04D-70-C3-R0

Thermal management systems are used in a variety of applications including electronics cooling, food storage, water cooling, and process vessels. Thermal-Heat Sinks provide the critical interface between the heat source and the cooling system. Heat sinks are often used to dissipate excess heat from integrated circuits, processors, and other heat sources to maintain the temperature within the optimal range. The ATS-04D-70-C3-R0 is a popular heat sink that is used in various applications.

The ATS-04D-70-C3-R0 is a 3-inch high finned heat sink constructed from anodized aluminum alloy. Its exterior design combines large tapered fin edges and multiple grooves to facilitate extensive heat transfer. Its center design also features a deep cup to capture more heat while still providing sufficient air access. The high thermal conductivity of aluminum ensures that the ATS-04D-70-C3-R0 has superior heat transfer capabilities compared to other heat sinks.

The ATS-04D-70-C3-R0 is designed to be used in a variety of applications. It is commonly used in power supplies, air-conditioning and ventilation systems, consumer electronics, and renewable energy equipment. It is also used in audio/video equipment, computers, applications that require cooling, heat exchange, and high power. With a temperature range of -40°C to 105°C, it is also used in industrial automation, robotics, and medical systems. The heat sink has a low profile and can be used in tight or narrow spaces.

The ATS-04D-70-C3-R0 works by dissipating the heat generated by the integrated circuits and processors to the environment. It is constructed with high thermal conductivity aluminum which absorbs the heat from the heat source and transfers it into the environment through surface convection. As air passes by the surface of the heat sink, it absorbs the heat and brings it away from the heat source. This process is known as air-cooling and it helps to maintain the temperature of the heat source within an optimal range.

In addition to air-cooling, the ATS-04D-70-C3-R0 also features a deep cup design which helps to capture and dissipate more heat. The additional heat capture helps to further maintain the temperature range within the optimal range. The cup design allows for greater air access which increases the amount of cooling available to the heat source.

The ATS-04D-70-C3-R0 is a durable and reliable thermal-heat sink that provides an effective solution for various applications. Its efficient design ensures that it can dissipate high amounts of heat from integrated circuits and processors quickly and effectively. The ATS-04D-70-C3-R0 also features a deep cup design which helps to capture and dissipate more heat, making it an ideal choice for applications that require a high degree of cooling.