ATS-04E-02-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04E-02-C1-R0-ND

Manufacturer Part#:

ATS-04E-02-C1-R0

Price: $ 3.20
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04E-02-C1-R0 datasheetATS-04E-02-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.91249
30 +: $ 2.83395
50 +: $ 2.67649
100 +: $ 2.51899
250 +: $ 2.36157
500 +: $ 2.28284
1000 +: $ 2.04668
Stock 1000Can Ship Immediately
$ 3.2
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an integral part of many electronics systems, from computers to spacecraft. They promote the efficient transfer of heat away from the critical components, and are usually necessary for the effective operation of an electronic device. Although there are many types of thermal solutions available, the ATS-04E-02-C1-R0 is a particularly effective choice for a variety of applications. This article will discuss the ATS-04E-02-C1-R0\'s application field and working principle.

The ATS-04E-02-C1-R0 is a pin-fin heat sink, and its pin fin construction offers several advantages for cooling components. The pin-fin design increases the surface area, which allows for more efficient heat dissipation. This increased surface area also increases airflow over the sink, which further increases its performance. Additionally, the pin-fin design also decreases thermal resistance, since it allows for a more direct flow of air over the device. This combination of factors makes the ATS-04E-02-C1-R0 an ideal solution for many applications.

The ATS-04E-02-C1-R0 is specifically designed for cooling applications such as integrated circuits and other high-power components. It is constructed of high-grade aluminum to ensure maximum thermal performance, and its finned construction allows for efficient heat dissipation. The pin-fin design also increases the ATS-04E-02-C1-R0\'s air-flow, meaning it is effective at even the highest operating temperatures.

The ATS-04E-02-C1-R0 also features a unique air-facing design which ensures maximum performance. This design utilizes an air-venting hole at the base of the heat sink, which allows for greater air flow over the entire surface area of the device. This air-expansion design also improves overall heat transfer, resulting in increased efficiency.

The ATS-04E-02-C1-R0 is also designed to be durable and easy to install. It is manufactured using high-quality materials, and is specifically designed to be robust and reliable. Additionally, it features a mounting plate with an adjustable mounting system, which allows the device to be easily installed into a variety of applications.

Overall, the ATS-04E-02-C1-R0 is an effective thermal solution for a variety of applications. Its pin-fin construction increases surface area and air-flow, as well as decreasing thermal resistance. It alsofeatures a unique air-facing design, and it is easy to install and durable. This combination of features makes the ATS-04E-02-C1-R0 a reliable and efficient choice for thermal applications.

The specific data is subject to PDF, and the above content is for reference

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