ATS-04E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-04E-10-C3-R0-ND

Manufacturer Part#:

ATS-04E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04E-10-C3-R0 datasheetATS-04E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an increasingly important field due to the rise in electronic components in every modern system. To achieve a high level of efficiency, the thermal design needs to consider the operation environment, heat generated by the application, and the design constraints such as allowable power dissipation, cost, size and airflow. ATS-04E-10-C3-R0 is a thermal solution that is engineered to meet a variety of thermal management challenges.

ATS-04E-10-C3-R0 Application Field

This compact, low-profile thermal solution is suitable for a variety of applications. It can be used in high-ambient-temperature applications such as automotive and industrial control systems, consumer electronics, and medical devices. It is also suitable for other applications requiring efficient heat removal, such as LEDs, high-performance graphics cards, and high-speed FPGAs.

ATS-04E-10-C3-R0 Working Principle

The ATS-04E-10-C3-R0 utilizes a combination of technologies to maximize thermal performance. The heatsink is designed with a natural downward-flow, aluminum-finned structure that utilizes convective and conductive heat transfer to move heat efficiently from the heat source. An optimized fan is also integrated into the design to ensure even heat distribution and maximum dissipation. The fan is equipped with a brushless DC motor for reliable operation and a long service life.

The airflow generated by the fan is then directed across the aluminum fins by a set of air-deflecting blade wings. This pressure-driven air movement increases the thermal performance of the heatsink while producing minimal noise. The rubber-covered fan blades and sturdy frame reduce vibration and sounds. Additionally, the aluminum fins use the air-deflecting blade wings to form an interlocking design, which further increases the thermal transfer performance.

The ATS-04E-10-C3-R0 can be used in a wide variety of applications due to its reduced height of 8.00mm and flexible mounting system. It is designed to fit into most systems without taking up too much space, making it an ideal solution for high-precision and specialty applications. The heatsink is available in multiple sizes with a variety of thermal profiles, making it a great choice for applications requiring efficient heat removal.

Overall, the ATS-04E-10-C3-R0 is an efficient thermal solution for a wide variety of applications. The combination of an optimized fan, aluminum fins, and air-deflecting blade wings provide superior heat transfer performance, while the low profile and flexible mounting system ensure a perfect fit. The ATS-04E-10-C3-R0 is a great choice for those in need of efficient thermal management solutions.

The specific data is subject to PDF, and the above content is for reference

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