| Allicdata Part #: | ATS-04E-102-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-102-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-102-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential element in the design of electronic devices, and it requires the use of specially designed heat sinks in order to keep electronic hardware running at optimal temperatures. The ATS-04E-102-C3-R0 is a particular type of thermal heat sink designed specifically for the purpose of heat dissipation from the surface of electronic components. It features a 3D extruded profile heat sink which ensures the coverage of all internal thermal peaks, and a built-in passive coolant for additional cooling. This heat sink has been designed for applications where the highest level of performance is required, particularly in applications with high power density.
Components of ATS-04E-102-C3-R0
The ATS-04E-102-C3-R0 is composed of two parts- a heat sink and a passive coolant. The heat sink is a 3D extruded profile heat sink that is designed to dissipate heat from the surface of the electronic components. The profile of the heat sink is designed to ensure a full contact between the electronic components and the heat sink. This ensures maximum heat dissipation from sensitive areas. The heat sink is also designed to minimize any adverse airflow effects, such as turbulence, which could cause the heat sink to become inefficient.
The passive coolant is designed to provide additional cooling to the heat sink. The passive coolant is a water-glycol mixture that is circulated through a cooling system that is built into the heat sink and around the PC board. The passive coolant is designed to absorb any additional heat from the device and cool it down efficiently and quickly, preventing the device from overheating or suffering damage from high temperatures.
Application Field and Working Principle of ATS-04E-102-C3-R0
The ATS-04E-102-C3-R0 is typically used in applications where the highest level of performance is desired, such as in devices with high power densities. It is designed to prevent components from suffering damage due to overheating, and features a 3D extruded profile heat sink that ensures complete contact between the electronic components and the heat sink. Additionally, the passive coolant ensures efficient cooling of the device by absorbing any additional heat. This combination of components ensures that the device is effectively cooled and operates at optimal temperatures.
The working principle of this heat sink is simple. It works through convective heat transfer, where the heat absorbed by the device is transferred through the device to the heat sink. The heat sink is designed to cover a large area of the device in order to efficiently dissipate the heat to its surroundings. The passive coolant further enhances the efficiency of the heat sink by circulating through the cooling system and absorbing any additional heat. This ensures that the device remains at optimal temperatures and is prevented from suffering any damage due to overheating.
Advantages and Disadvantages of ATS-04E-102-C3-R0
The ATS-04E-102-C3-R0 has a number of advantages over other thermal heat sinks. Firstly, it is designed to dissipate heat more efficiently than most other heat sinks. It features a 3D extruded profile which ensures complete contact between the components and the heat sink, resulting in an efficient heat transfer. Additionally, the passive coolant ensures that any additional heat is absorbed and efficiently cooled, preventing the device from suffering damage due to overheating. This ensures that high powered components can be kept at optimal temperatures and operate efficiently.
One of the drawbacks of the ATS-04E-102-C3-R0 is that it is more expensive than other thermal heat sinks. This is because it is designed for use in applications with higher power densities, which require a greater amount of thermal heat sink material. Furthermore, the passive coolant system is also more expensive. Despite these drawbacks, the ATS-04E-102-C3-R0 is an effective and reliable thermal heat sink that provides excellent thermal performance for applications with high power densities.
Conclusion
The ATS-04E-102-C3-R0 is a thermal heat sink specifically designed for applications with high power densities. It features a 3D extruded profile heat sink which ensures the coverage of all internal thermal peaks, and a built-in passive coolant for additional cooling. This heat sink is designed to dissipate heat efficiently and prevent components from suffering damage due to overheating. Despite its relatively high cost, it is an effective and reliable thermal heat sink that is well suited for applications with high power densities.
The specific data is subject to PDF, and the above content is for reference