| Allicdata Part #: | ATS-04E-112-C3-R1-ND |
| Manufacturer Part#: |
ATS-04E-112-C3-R1 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-112-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.76009 |
| 30 +: | $ 5.44026 |
| 50 +: | $ 5.12026 |
| 100 +: | $ 4.80022 |
| 250 +: | $ 4.48021 |
| 500 +: | $ 4.16019 |
| 1000 +: | $ 4.08019 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.38°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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```htmlThe ATS-04E-112-C3-R1 is a thermal device used to help improve the efficiency of cooling devices employed in countless industrial and electronic applications. By adding a thermal component to a cooling device, the ATS-04E-112-C3-R1 effectively maximizes the efficiency of the device by reducing the amount of heat lost during operation. The ATS-04E-112-C3-R1 belongs to the Thermal - Heat Sinks category and is commonly used in applications such as thermal management, liquid cooling, air-to-air cooling, and heat transfer.
The ATS-04E-112-C3-R1 consists of a base, a fan, and a heat sink. The base attaches to the device that is being cooled, and provides a surface area for the fan and heat sink to be mounted to. The fan is mounted to the base and functions to blow air over the attached component in order to cool it. The heat sink is attached to the base and facilitates the transfer of heat away from the component in order to protect it from overheating.
The ATS-04E-112-C3-R1 thermal component operates on the principle of heat convection, wherein heat is moved away from the device and dispersed into the surrounding environment. In operation, the fan blows air over the surface of the component. The air brought in by the fan is cooler than the air surrounding the component, and has a lower temperature. This cooler air moves through the heat sink, absorbing the component’s heat and transferring it away to its surroundings. The air is then released back into the environment, thus allowing fresh cooler air to be brought back in through the fan.
In some applications, such as liquid cooling systems, the ATS-04E-112-C3-R1 can be used in conjunction with a heat exchanger to further increase the efficiency of the cooling system. In liquid cooling systems, the heat sink is attached to the radiator, and the fan is used to blow air across the radiator. This air is then used to cool the liquid running through the radiator, which in turn cools the component. The ATS-04E-112-C3-R1 can also be used in air-to-air cooling systems, where it can be attached to a fan in order to direct the airflow over the device being cooled.
The ATS-04E-112-C3-R1 thermal device is an effective tool for improving the efficiency of cooling devices employed in many industrial and electronic applications. By utilizing heat convection, the ATS-04E-112-C3-R1 helps to keep components from overheating and maximize the efficiency of the cooling system. This device belongs to the Thermal - Heat Sinks category, and is commonly used in applications such as thermal management, liquid cooling, air-to-air cooling, and heat transfer. By using the ATS-04E-112-C3-R1 in the appropriate application, users can achieve the best performance out of their cooling systems.
```The specific data is subject to PDF, and the above content is for reference