ATS-04E-116-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are devices mounted onto electronics that dissipate heat away from the electronics. They are typically made of materials such as copper, aluminium or plastic, and their construction includes finned heat-conducting surfaces that cool the devices with which they are used. Heat sinks are used in a wide variety of electronic applications – from home electronics, to cars, to industrial robots – where they help reduce the temperature of the devices, thus preventing them from overheating and malfunctioning.

Understanding ATS-04E-116-C2-R0

The ATS-04E-116-C2-R0 is a High-Performance Heat Sink For Electronic Applications. It is most commonly used for cooling transistors, integrated circuits, microprocessors, power management ICs, and passive components. The ATS-04E-116-C2-R0 has been optimised to achieve superior thermal performance in a wide range of temperatures and applications.The ATS-04E-116-C2-R0 has a unique pin-fin-array design, with fins that are precisely spaced and densely-packed that are designed to dissipate heat away quickly and efficiently. Additionally, the staggered-length of the internal fins enable the ATS-04E-116-C2-R0 to manage air flow and reduce turbulent air resistance ensuring reliable and consistent cooling capabilities.The ATS-04E-116-C2-R0 is made from aluminium and high-efficiency durable base material. This makes it extremely light compared to other similar thermal solutions, and also resistant against various environments. It also features a broad range of mounting options, including mounting holes, holes with screws, SMDs and more – making it ideal for a wide range of applications.

Application Fields And Working Principle of ATS-04E-116-C2-R0

The ATS-04E-116-C2-R0 heat sink is used primarily in surface mount and full-band applications, owing to its superior heat-dissipation capabilities and design. It is ideal for cooling transistors, integrated circuits, microprocessors, power management ICs, and passive components in devices such as:1. Mobile phone processors2. Projectors3. IoT devices4. Automotive components5. Led lighting6. Medical devices7. AerospaceThe ATS-04E-116-C2-R0 thermal heat sink has multiple thermal features that reduce the temperature of the device it is cooling, thus preventing the device from overheating. Its unique pin-fin-array design and its staggered-length internal fins allow the heat sink to effectively absorb and dissipate heat away quickly without producing turbulence. It also helps to create a ventilating flow of air around the device, ensuring reliable and consistent temperature levels. Additionally, the ATS-04E-116-C2-R0’s construction materials consists of aluminium and a high-efficiency durable base material, making it lightweight and resistant to various environments. Its multiple mounting options allow for the heat sink to be installed in any device quickly and easily.Overall, the ATS-04E-116-C2-R0 heat sink is a reliable and effective thermal solution for a wide range of different applications. Its superior heat-dissipation capabilities, design, and construction make it one of the most popular thermal solution on the market.

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