| Allicdata Part #: | ATS-04E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-04E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
Heat sinks are a type of passive cooling device used to dissipate heat from a component due to the thermal properties of the material used in their construction. Heat sinks are devices that take advantage of the unique properties of certain materials to absorb and transfer heat energy away from parts that generate it. Examples include the heat that is generated by components such as microchips, resistors, transistors, coils and other electronic components.
ATS-04E-117-C1-R0 Application Field and Working Principle
The ATS-04E-117-C1-R0 heat sink is an electrically insulated aluminum heat sink designed to dissipate thermal energy from electronic components. It is the perfect choice for those struggling to keep their equipment within its optimal temperature range. As a result, it’s the choice of many high profile engineers for their projects.
The ATS-04E-117-C1-R0 uses cross-sectional area design to provide maximum cooling efficiency. Its design offers air passages that allow air to efficiently flow throughout the body to quickly dissipate the heat. The heat sink’s thermal design has been optimized to provide superior thermal management for heat dissipation.
The ATS-04E-117-C1-R0 features an aluminized silicon insulation barrier that prevents thermal energy from escaping. This insulation material has been designed to reduce heat loss due to thermal conduction by up to 75%.
The ATS-04E-117-C1-R0 is designed to be easy to install. With its built-in temperature sensor, the ATS-04E-117-C1-R0 allows for easy and accurate temperature monitoring. It also offers a secure and reliable fitment that ensures proper thermal management. The ATS-04E-117-C1-R0 also features a low thermal resistance design that makes it an excellent choice for heat dissipation in confined spaces.
The ATS-04E-117-C1-R0 is an highly efficient and reliable heat sink choice for those working on electronic projects and requiring a reliable thermal management solution. The ATS-04E-117-C1-R0 provides great heat dissipation capabilities, plus maximized cooling and thermal insulated characteristics. Its aluminized silicon insulation barrier prevents thermal energy from escaping and improves its overall thermal performance. It is also a great solution for restrictive spaces due to its low thermal resistance design.
The specific data is subject to PDF, and the above content is for reference