| Allicdata Part #: | ATS-04E-133-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-133-C3-R0 |
| Price: | $ 6.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-133-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.77206 |
| 30 +: | $ 5.45118 |
| 50 +: | $ 5.13047 |
| 100 +: | $ 4.80986 |
| 250 +: | $ 4.48920 |
| 500 +: | $ 4.16855 |
| 1000 +: | $ 4.08839 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an increasingly important aspect of modern technology. Heat dissipation and thermal regulation are issues that need to be addressed in order to ensure the longevity, efficiency, and quality of many electronic components. Heat sinks are passive components that are used to absorb and dissipate heat from other components, such as microprocessors and ICs. ATS-04E-133-C3-R0 is a type of heat sink that is used for a variety of applications.
The ATS-04E-133-C3-R0 heat sink is a highly efficient and cost-effective solution for cooling a wide range of electronic components. It is constructed of durable aluminum and features a high-performance extruded fin design that provides superior thermal performance. The thermal conductor consists of a hollow, aluminum plated copper rod that is inserted into a thermal gap between the heat sink base and the component being cooled. The copper rod is surrounded by a special epoxy composite material that provides excellent thermal conductivity.
The ATS-04E-133-C3-R0 is used in a variety of applications including LED lighting, power supplies, circuit boards, and telecom switches. The heat sink can be used to keep temperatures on these components from becoming dangerously hot, and it also helps extend the life of the components. The heat sink is designed to effectively dissipate heat away from the components and outwards from the enclosure. Additionally, the heat sink can be used to regulate the temperature of a component in order to optimize performance and reduce noise.
The working principle behind the ATS-04E-133-C3-R0 is fairly simple. Heat is transferred from the component being cooled to the heat sink via conduction. The thermal conductor is designed to allow heat to flow easily from the component to the heat sink, allowing it to be effectively dissipated away. The fins on the heat sink help to further dissipate the heat outwards from the component, helping to keep temperatures under control and preventing them from becoming too hot.
Overall, the ATS-04E-133-C3-R0 is an effective and efficient heat sink that can be used in a variety of applications. It is constructed of high-quality materials and features a high-performance design that provides superior thermal performance. The heat sink is designed to easily dissipate heat away from the component being cooled, helping to keep temperatures under control and extend the life of the component. With the wide range of applications and features that the ATS-04E-133-C3-R0 offers, it is no wonder that it is such a popular choice among those looking for efficient thermal management solutions.
The specific data is subject to PDF, and the above content is for reference