| Allicdata Part #: | ATS-04E-160-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-160-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-160-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management is an important factor for many electronic components. The ATS-04E-160-C3-R0 Heat Sink is a high performance heat sink designed for optimal dissipation of heat generated from electronic components. It is an extruded aluminum heat sink designed to maintain a low temperature environment for electronic components. The ATS-04E-160-C3-R0 Heat Sink is designed with a series of fins that increase the surface area available for heat transfer, so that heat is quickly dissipated from the components. In addition, the heat sink is designed with an optimized thermal profile that helps to diffuse heat away from the components.
The ATS-04E-160-C3-R0 is a versatile heat sink designed for a wide range of applications. It is suitable for most types of electronic components, including CPUs, GPUs, memory modules, and power modules. It is also suitable for industrial applications where high temperatures occur due to prolonged usage or extreme environmental conditions. Furthermore, it can be used in a range of avionics, automotive and robotics applications, with a reinforced self-clinching technology to ensure secure attachment of the heat sink.
The heat dissipating ability of this heat sink is further enhanced with the inclusion of a heat pipe layer. This heat pipe layer is integrated into the fins and helps to dissipate heat from the electronic components to the air. The heat pipe layer has an enhanced thermal conductivity that helps to reduce the thermal impedance between the hot and cold surfaces. In addition, the installation of the heat pipe helps to improve the airflow inside the heat sink, so that heat can be quickly dissipated from the components.
The ATS-04E-160-C3-R0 Heat Sink is designed with an optimized air flow pattern that helps to maximize the performance of the components. The shape and size of the fins are designed to ensure an even distribution of air flow across the heat sink to ensure optimal heat transfer. The heat sink also has an internal baffle design that helps to reduce turbulence and ensure a consistent air flow over the entire surface of the heat sink for efficient heat transfer.
The ATS-04E-160-C3-R0 Heat Sink is designed for simple, effective thermal management. It is easy to install and requires minimal maintenance. Furthermore, the heat sink is RoHS compliant, meaning it is free from hazardous materials, and is suitable for a wide range of industrial, avionics, automotive and robotics applications. The heat sink is also backed by a five-year warranty, ensuring that it will perform to a high standard for years to come.
The specific data is subject to PDF, and the above content is for reference