ATS-04E-163-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-04E-163-C1-R0-ND

Manufacturer Part#:

ATS-04E-163-C1-R0

Price: $ 3.86
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-04E-163-C1-R0 datasheetATS-04E-163-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.50469
30 +: $ 3.31002
50 +: $ 3.11535
100 +: $ 2.92062
250 +: $ 2.72591
500 +: $ 2.53120
1000 +: $ 2.48253
Stock 1000Can Ship Immediately
$ 3.86
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are components used to move heat generated by electronic components into their surrounding environment. By doing this, it helps to reduce the temperature of the electronic components and prevents them from getting too hot and damaging them. The ATS-04E-163-C1-R0 is a thermal-heat sink product and is a very common and widely used product in the electronics and thermal industry. This article will explain the application field and working principle of the ATS-04E-163-C1-R0 thermal-heat sink.

The primary application of the ATS-04E-163-C1-R0 is for protecting and cooling electronic components from over-heating. It can be used in a variety of applications, including but not limited to consumer electronics, industrial equipment, computers, military and aerospace, and automotive systems. It is designed to be used as part of component packages that require thermal management or cooling solutions, such as processor packages, power supplies, or other heat generating components. It is also used in environments with high ambient temperatures.

The ATS-04E-163-C1-R0 is an efficient and reliable thermal-heat sink solution. It is constructed from high-quality aluminum and features a low-profile design that is both thermally and mechanically efficient. It is also designed with an anodized finish and can be used in high-pressure, high-temperature, and high-altitude applications. The ATS-04E-163-C1-R0 offers a wide range of performance choices, including a large thermal capacity, a maximum temperature of up to 125°C, and a variety of mounting options. The product is also UL-recognized and complies with various safety standards.

The ATS-04E-163-C1-R0 thermal-heat sink operates on the principle of thermal conductivity. It works by transferring heat away from hot spots within the electronic component package and diverts heat to the surface of the heat sink. This causes the surface of the heat sink to heat up, allowing it to dissipate the heat into the environment. This process is known as a convection-based cooling process. In addition, the heat sink utilizes fins or heat-spreaders to maximize its performance by increasing surface area and allowing for better air circulation.

The ATS-04E-163-C1-R0 is an effective and efficient thermal management solution that is suitable for a wide range of applications. It is simple to install and provides reliable performance in a variety of environments. In addition, it is UL-recognized and compliant with various safety standards, making it an ideal choice for electronic application packages. By providing effective thermal management solutions, the ATS-04E-163-C1-R0 allows electronic components to operate at their maximum performance levels without failing due to high temperatures.

The specific data is subject to PDF, and the above content is for reference

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