| Allicdata Part #: | ATS-04E-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-04E-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are critical components used in various industrial applications. The term “heat sink” refers to the fact that the component is used to dissipate heat in order to keep the components that it is connected to from becoming overheated.
ITHAC Industries is well equipped to handle any need for thermal management and has released an outstanding product, the ATS-04E-185-C3-R0. This product is designed to provide excellent heat transfer capabilities while also being energy efficient.
The ATS-04E-185-C3-R0 is a heat sink designed to help components stay cool. It consists of two parts, the heat dissipating component and the thermal-enhancing component. The heat dissipating component consists of a large fin array which acts as a heat exchanger. This helps to draw the heat away from the component and disperse it into the surrounding environment. The thermal-enhancing component consists of a number of smaller fins which act as air ducts. These fins help to transfer the heat more quickly and efficiently to the environment. The combination of the two parts makes the ATS-04E-185-C3-R0 a great choice for those who need thermal performance at an affordable price.
The ATS-04E-185-C3-R0 is designed to be easy to install and can be used with a variety of components. It can be used with CPUs, GPUs, motherboards, cases, power supplies, and more. This makes the ATS-04E-185-C3-R0 extremely versatile and capable of handling a wide range of applications.
The ATS-04E-185-C3-R0 is also designed to be energy efficient, using minimal energy to do its work. This makes it an ideal choice for applications where power savings are a primary concern. The ATS-04E-185-C3-R0 is also designed to work with both air-cooled and liquid-cooled systems. This means that it can be used in any system where thermal management is required.
The ATS-04E-185-C3-R0 is a great choice for those in need of thermal management. It is designed to provide excellent heat transfer capabilities as well as energy efficiency. Its versatile design makes it a great choice for a variety of applications. For those in need of reliable and affordable thermal management, the ATS-04E-185-C3-R0 is the perfect solution.
The specific data is subject to PDF, and the above content is for reference