| Allicdata Part #: | ATS-04E-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-04E-209-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-04E-209-C1-R0 thermal heat sink is a device used to assist in the efficient transfer of kinetic energy from overheating electronics. Its design consists of various characteristics that allow it to seamlessly integrate into a variety of applications, while also providing optimal performance. In this article, we will explore the various attributes of the ATS-04E-209-C1-R0 thermal heat sink, its application fields, and its working principle.
The ATS-04E-209-C1-R0 thermal heat sink is constructed from aluminum, which makes it lightweight yet stiff and durable. It has an anodized surface finish to protect against environmental damage and wear. The combination of these characteristics makes the ATS-04E-209-C1-R0 ideal for applications in a variety of industries, including power electronics, automotive, LED lighting, and computer. Additionally, the ATS-04E-209-C1-R0 is able to endure extreme temperatures, making it ideal for industrial and commercial equipment.
When heat is generated in electronic devices, the ATS-04E-209-C1-R0 thermal heat sink provides a conductive or convective medium that dissipates the heat away from the device. Its cooling capability is improved by its efficient metal-air interface that helps to keep the device running at optimal temperature. By dissipating the heat away from the device, the ATS-04E-209-C1-R0 works to reduce the electricity cost in addition to protecting the device from damage due to overheating.
The working principle of the ATS-04E-209-C1-R0 is based on a concept known as convection. When the surface of the heat sink makes contact with the hot electronics, it absorbs the heat and transfers it away from the device. The heat is then dissipated into the ambient air through small vents in the heat sink, which is how the heat is eventually removed from the device. The process of removing the heat from the device is known as convection.
The ATS-04E-209-C1-R0 is a versatile product that can be used in a variety of different applications. In addition to its use in the electronics industry, the ATS-04E-209-C1-R0 is also well-suited for use in medical equipment as well as PCBs and consumer electronics. Additionally, the ATS-04E-209-C1-R0 can be used as a cooling component in many other industries, such as HVAC, gaming consoles, and refrigeration.
To summarize, the ATS-04E-209-C1-R0 is a thermal heat sink designed to be lightweight, durable, and efficient in transferring heat away from overheating electronics. It can be used in a variety of industries and applications due to its versatility and ability to perform optimally in a wide range of temperatures. The working principle is based on convection, which ensures the device is cooled effectively. In conclusion, the ATS-04E-209-C1-R0 is an excellent choice for applications requiring thermal management.
The specific data is subject to PDF, and the above content is for reference