| Allicdata Part #: | ATS8322-ND |
| Manufacturer Part#: |
ATS-04E-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are a type of thermal management solution used to dissipate the heat that many electronic components generate. One such product is the ATS-04E-27-C2-R0, an extruded aluminum heat sink capable of dissipating up to 60 Watts of power. This article will discuss the application field and working principle of this device.
The ATS-04E-27-C2-R0 is designed for cooling applications in the telecommunications, consumer electronics, automation and industrial sectors. It is ideal for use in applications such as switch-mode power supplies, voltage regulator modules, high-power amplifiers and circuit protection devices. It is designed for low profile installations, with a total length of only 45 mm and height of 27 mm. This makes it ideal for space constrained applications, such as those found in mobile phones, tablets and other compact electronic devices. In addition, it is designed to operate in ambient temperatures up to 85° C, making it suitable for high temperature environments.
In terms of its working principle, the ATS-04E-27-C2-R0 uses a combination of extrusion, convection and axial airflow cooling methods to dissipate heat generated by electronic components. The heat sink is designed to efficiently remove heat from a component by using its aluminum extrusions to draw heat away from the component and into its fins. The heat is then dissipated into the surrounding air using convection and axial airflow solutions. The fins are designed to increase the surface area, allowing the heat to be dissipated more effectively, while the axial airflow methods ensure that the heat is evenly spread over the fins.
The ATS-04E-27-C2-R0 is a great example of how an optimized thermal-heat sink can be used to efficiently remove heat from electronic components. Its combination of extrusion, convection and axial airflow cooling methods make it ideal for cooling applications in the telecommunications, consumer electronics, automation and industrial sectors. Its low profile design makes it suitable for space-constrained applications, while its operating temperature up to 85° C allows it to safely operate in high temperature environments. As such, it is an invaluable thermal management solution for many electronic applications.
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