| Allicdata Part #: | ATS-04E-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-04E-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-04E-33-C1-R0 thermal - heat sink has a variety of applications and operates on simple principles.
A thermal - heat sink is a device designed to transfer heat away from the source into a cooler environment. In its simplest form, it consists of a metal with high thermal conductivity and a series of fins designed to increase the surface area of the device for maximum heat dissipation. The ATS-04E-33-C1-R0 is such a device.
This device can be used for a variety of purposes, including cooling components such as processors, power supplies, and other components with higher than average operating temperatures. Heat sinks are also used to dissipate heat in various electronic and electrical systems, such as computers, lasers, and radios. In addition, these devices are used in cooling various industrial and residential appliances such as refrigerators, air conditioners, and other electronics.
The working principle of the ATS-04E-33-C1-R0 is relatively simple. The heat generated by the components is transferred to the thermal - heat sink device via conduction. The thermal - heat sink acts as a static dissipator, absorbing the heat from the components and transferring it to the air via convection.
The ATS-04E-33-C1-R0 features a multi-stacked fin design, which provides a larger surface area than traditional heat sinks for improved heat dissipation. The fins are layered in a staggered configuration, which provides for maximum heat transfer to the air. The fins are also spaced and curved to minimize air resistance and increase airflow, further enhancing the cooling effect. The entire device is made of aluminum, which has excellent thermal conductivity and durability.
The ATS-04E-33-C1-R0 is equipped with a direct contact heat-pipe which eliminates airspace resistance and increases the efficiency of the heat dissipating process. This heat-pipe is based on the natural properties of liquids and vapor, which allows heat to be transferred directly to the surface of the heat sink. This increases efficiency and reduces the amount of time required for maximum heat dissipation.
The ATS-04E-33-C1-R0 is easy to install and requires minimal effort. It can be mounted on a variety of surfaces, such as a motherboard or a chassis. The device has universal screws and mounts, which make installation straightforward and easy to complete.
Overall, the ATS-04E-33-C1-R0 thermal - heat sink is an ideal choice for instances where cooling is a priority. With its superior design and efficient operation, this device provides an excellent solution to overheating issues in many applications.
The specific data is subject to PDF, and the above content is for reference