| Allicdata Part #: | ATS-04E-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-04E-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-04E-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used in many fields of technology. The main purpose of a heat sink is to dissipate heat from an assembled component or device. Heat sinks have become more important with the rise of integrated circuit chips, as these components need to operate at lower temperatures in order to function efficiently and reliably. Heat sinks, then, are needed to properly regulate the temperatures of the components and keep them operating within their operating temperature range.
The ATS-04E-60-C1-R0 is one type of heat sink suitable for various applications and can be used for cooling components such as printed circuit boards, CPUs, amplifiers, power supplies, and more. This product is made of extruded aluminum which provides excellent heat dissipation and is anodized to prevent corrosion. Its design includes four fins with one or two fan modules and a size that makes it suitable for 1U or 2U applications.
The working principle behind ATS-04E-60-C1-R0 is that of convection. Air is drawn across the fins of the heat sink, which in turn is cooled by exchanging with the ambient air temperature. As the air passes through the fins, it absorbs the heat from the components and dissipates it into the ambient air, allowing the components to cool down. This process can be further enhanced by adding fans to the design, which would increase the air velocity across the fins and further increase the effectiveness of the heat dissipation.
ATS-04E-60-C1-R0 thermal - heat sinks are suitable for many applications. They can be used in 1U or 2U application settings, such as in industrial control panels, industrial automation systems, and more. It can also be used in any electronic product where the components need to be cooled. Additionally, they are a popular choice for applications that require a slim, low profile design, since the heat sink is just 1U in height.
In conclusion, the ATS-04E-60-C1-R0 thermal - heat sink is an excellent choice for cooling components in industrial control panels, industrial automation systems, and other electronic products. It features a slim, low profile design and is effective at dissipating heat through convection and can be enhanced with additional fans. This product is anodized to protect against corrosion and is an excellent option for applications where a slim, low profile design is necessary.
The specific data is subject to PDF, and the above content is for reference