ATS-04E-63-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks are devices that are designed to dissipate heat generated by electrical components such as power amplifiers, CPUs, and microprocessors, and are often used to cool computer processors and other sensitive electronic components. By cooling these components efficiently, they help to prevent expensive system failures.Convection is one of the most efficient and preferred cooling methods for thermal-heat sinks, due to its ability to quickly and easily move heat to the surrounding atmosphere. This is accomplished through the specific design and placement of fins, which serves to increase the surface area of the thermal-heat sink, allowing the heat sink to increase the amount of heat that it can dissipate into the air.The ATS-04E-63-C2-R0 heat sink is one such example of a convection-cooled heat sink. This particular heat sink is designed to meet the special requirements of high-frequency transistors and is suitable for a variety of applications.

ATS-04E-63-C2-R0 Application Field and Working Principle

The ATS-04E-63-C2-R0 is a thermal-heat sink designed to provide efficient heat dissipation for high-frequency transistors used in radio communications, power amplifiers, power supplies, and other sensitive electronic components. This type of heat sink is specially designed for use in highly sensitive applications and is constructed from aluminum plates with copper fillers. This combination increases its ability to expel heat and ensures long-term and reliable performance.The ATS-04E-63-C2-R0 utilizes a specially designed fin array to provide maximum cooling efficiency. The fin array is designed to maximize air flow around the heat sink to allow for maximum heat dissipation. It also has an anodized surface to protect against corrosion and minimize surface deformation.In conjunction with a fan, the ATS-04E-63-C2-R0 is an effective cooling device that can help ensure that your sensitive electronic components remain working as they should. The fan helps to draw in the cool air from the surrounding environment and increase the rate of heat exchange between the component’s surface and the heat sink.

Conclusion

The ATS-04E-63-C2-R0 thermal-heat sink is a great example of a convection-cooled heat sink that can provide efficient and reliable cooling for sensitive electronic components. Its combination of aluminum plates and copper fillers makes it an excellent choice for applications that require high-frequency transistor cooling. In conjunction with a fan it can help to ensure that your components continue to function properly.

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